Patent Assignment Details
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| Reel/Frame: | 011006/0066 | |
| Pages: | 2 |
| | Recorded: | 07/28/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/06/2001
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Application #:
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09274506
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Filing Dt:
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03/23/1999
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Title:
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CHIP MODULE WITH A PLURALITY OF FLAT CONTACT ELEMENTS MOUNTABLE ON EITHER AN EXTERNAL PRINTED CIRCUIT BOARD OR AN EXTERNAL BOARD SUBSTRATE
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Assignee
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| ZT GG VM |
| POSTFACH 22 16 34 |
| MUNCHEN, GERMANY 80506 |
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Correspondence name and address
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LERNER AND GREENBERG, P.A.
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MARK P. WEICHSELBAUM
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P.O. BOX 2480
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HOLLYWOOD, FLORIDA 33022
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