Patent Assignment Details
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Reel/Frame: | 058136/0066 | |
| Pages: | 11 |
| | Recorded: | 11/17/2021 | | |
Attorney Dkt #: | 1012-3159/2018P50829 US01 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/09/2024
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Application #:
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17528313
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Filing Dt:
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11/17/2021
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Publication #:
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Pub Dt:
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03/10/2022
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Title:
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Method for Forming an Insulation Layer in a Semiconductor Body and Transistor Device
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Assignee
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SIEMENSSTRASSE 2 |
VILLACH, AUSTRIA 9500 |
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Correspondence name and address
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MURPHY BILAK & HOMILLER/INFINEON TECHNO
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1255 CRESCENT GREEN
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CARY, NC 27518
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06/21/2024 11:04 AM
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