Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 020407/0067 | |
| Pages: | 3 |
| | Recorded: | 01/24/2008 | | |
| Attorney Dkt #: | OP97007/009 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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05/29/2012
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Application #:
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12018897
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Filing Dt:
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01/24/2008
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Publication #:
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Pub Dt:
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07/09/2009
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Title:
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METALLIC PANEL ASSEMBLY HAVING MULTILAYER ARRAYS OF MICROPORES
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12018920
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Filing Dt:
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01/24/2008
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Publication #:
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Pub Dt:
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07/09/2009
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Title:
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Method for Manufacturing Metallic Panel Having Multilayer Arrays Of Micropores
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Assignee
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| 268,HWA-YA 2ND ROAD, HWA-YA TECH. PARK, GUEISHAN |
| TAOYUAN, TAIWAN |
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Correspondence name and address
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HDSL
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4331 STEVENS BATTLE LANE
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FAIRFAX, VA 22033
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