Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 036818/0067 | |
| Pages: | 3 |
| | Recorded: | 10/19/2015 | | |
| Attorney Dkt #: | 1340.00001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/08/2017
|
Application #:
|
14435955
|
Filing Dt:
|
04/15/2015
|
|
Publication #:
|
|
Pub Dt:
|
11/19/2015
| | | | |
|
Title:
|
METHOD FOR WAFER ETCHING IN DEEP SILICON TRENCH ETCHING PROCESS
|
|
|
Assignee
|
|
|
|
|
| NO. 8 XINZHOU ROAD |
| WUXI NEW DISTRICT |
| JIANGSU 214028, CHINA |
|
|
Correspondence name and address
|
| |
WIDERMAN MALEK, PL
|
| |
1990 W. NEW HAVEN AVE.
|
| |
SUITE 201
|
| |
MELBOURNE, FL 32904
|
Search Results as of:
05/29/2024 08:59 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
