Patent Assignment Details
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| Reel/Frame: | 038050/0067 | |
| Pages: | 2 |
| | Recorded: | 03/21/2016 | | |
| Attorney Dkt #: | T5057-R281A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/22/2018
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Application #:
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15075729
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Filing Dt:
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03/21/2016
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Publication #:
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Pub Dt:
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07/14/2016
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Title:
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BONDING METHOD INCLUDING ADJUSTING SURFACE CONTOURS OF A BONDING SYSTEM
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Assignee
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| NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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Correspondence name and address
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HAUPTMAN HAM, LLP (TSMC)
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2318 MILL ROAD
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SUITE 1400
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ALEXANDRIA, VA 22314
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