Patent Assignment Details
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| Reel/Frame: | 024617/0068 | |
| Pages: | 4 |
| | Recorded: | 06/30/2010 | | |
| Attorney Dkt #: | TW-GNA-0739CA2 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/01/2012
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Application #:
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12827133
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Filing Dt:
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06/30/2010
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Publication #:
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Pub Dt:
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10/21/2010
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Title:
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STACKED CHIP PACKAGE STRUCTURE WITH LEADFRAME HAVING BUS BAR
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Assignees
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| NO.1, R&D RD.1, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU CITY, TAIWAN |
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| CANON'S COURT, 22 VICTORIA STREET, |
| HAMILTON, BERMUDA HM12 |
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Correspondence name and address
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SINORICA, LLC
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2275 RESEARCH BLVD.
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SUITE 500
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ROCKVILLE, MD 20850
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