Patent Assignment Details
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Reel/Frame: | 013334/0069 | |
| Pages: | 7 |
| | Recorded: | 09/27/2002 | | |
Conveyance: | CORRECTED TO INCLUDE ASSIGNEE'S ADDRESS |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/01/2005
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Application #:
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10119315
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Filing Dt:
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04/10/2002
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Publication #:
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Pub Dt:
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11/14/2002
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Title:
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SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MOUNTING METHOD
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Assignee
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10-1, NAKAZAWA-CHO |
HAMAMATSU-SHI |
SHIZUOKA-KEN, JAPAN |
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Correspondence name and address
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DICKSTEIN SHAPIRO ET AL.
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EDWARD A. MEILMAN
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1177 AVENUE OF THE AMERICAS
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41ST FLOOR
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NEW YORK, NY 10036-2714
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