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Reel/Frame:050326/0071   Pages: 3
Recorded: 09/10/2019
Attorney Dkt #:ASEE00005 US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/05/2021
Application #:
16565064
Filing Dt:
09/09/2019
Publication #:
Pub Dt:
03/11/2021
Title:
EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Assignors
1
Exec Dt:
09/06/2019
2
Exec Dt:
09/06/2019
Assignee
1
NO. 10, XINJING 1ST RD., NANTZE EXPORT PROCESSING ZONE
KAOHSIUNG, TAIWAN 811
Correspondence name and address
INNOVATION COUNSEL LLP
2890 ZANKER ROAD, SUITE 200
SAN JOSE, CA 95134

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