Patent Assignment Details
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Reel/Frame: | 026977/0074 | |
| Pages: | 4 |
| | Recorded: | 09/27/2011 | | |
Attorney Dkt #: | 2703-3 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13232515
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Filing Dt:
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09/14/2011
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Publication #:
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Pub Dt:
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03/14/2013
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Title:
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HEAT-CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SUBSTRATE CONTAINING THE SAME
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Assignee
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NO. 24-1 INDUSTRY E. RD. IV, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN |
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Correspondence name and address
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EGBERT LAW OFFICES PLLC
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412 MAIN ST., 7TH FLOOR
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ATTN: KEVIN W. MCDANIEL
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HOUSTON, TX 77002
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06/18/2024 01:58 AM
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