Patent Assignment Details
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| Reel/Frame: | 054322/0074 | |
| Pages: | 10 |
| | Recorded: | 11/10/2020 | | |
| Attorney Dkt #: | BTA 2004 USUA1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/30/2024
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Application #:
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17052853
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Filing Dt:
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03/23/2021
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Publication #:
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Pub Dt:
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03/30/2023
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Title:
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THROUGH SILICON VIA STRUCTURE FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT PACKAGING AND MANUFACTURING METHOD THEREOF
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Assignees
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| 220 HANDAN ROAD |
| YANGPU DISTRICT |
| SHANGHAI, CHINA 200433 |
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| ROOM 401-23, NO. 690 |
| BIBO ROAD, PILOT FREE TRADE ZONE |
| SHANGHAI, CHINA 200120 |
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Correspondence name and address
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THOMAS E. LEES, LLC
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90 RHOADS CENTER DRIVE
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DAYTON, OH 45458
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