Patent Assignment Details
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Reel/Frame: | 016054/0075 | |
| Pages: | 5 |
| | Recorded: | 12/03/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11003680
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Filing Dt:
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12/03/2004
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Publication #:
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Pub Dt:
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06/09/2005
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Title:
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Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment
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Assignee
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1006, OAZA KADOMA |
KADOMA-SHI |
OSAKA 571-8501, JAPAN |
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Correspondence name and address
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MERCHANT & GOULD PC
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P.O. BOX 2903
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MINNEAPOLIS, MN 55402-0903
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09/21/2024 11:41 AM
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