Patent Assignment Details
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| Reel/Frame: | 055809/0076 | |
| Pages: | 7 |
| | Recorded: | 04/02/2021 | | |
| Attorney Dkt #: | 8947-001591-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/27/2022
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Application #:
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17220468
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Filing Dt:
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04/01/2021
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Publication #:
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Pub Dt:
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03/03/2022
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Title:
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SEMICONDUCTOR PACKAGE
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Assignee
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, P.L.C.
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P.O. BOX 8910
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RESTON, VA 20195
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11/10/2024 01:08 PM
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