Patent Assignment Details
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Reel/Frame: | 010656/0077 | |
| Pages: | 2 |
| | Recorded: | 02/28/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/02/2000
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Application #:
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09103163
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Filing Dt:
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06/22/1998
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Title:
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METHOD FOR THE PRODUCTION OF FLIP-CHIP MOUNTING-READY CONTACTS OF ELECTRICAL COMPONENTS
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Assignee
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POSTFACH 22 16 34 |
MUNCHEN, GERMANY 80506 |
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Correspondence name and address
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LERNER AND GREENBERG
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RALPH E. LOCHER
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P.O. BOX 2480
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HOLLYWOOD, FL 33022
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