Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 066061/0078 | |
| Pages: | 3 |
| | Recorded: | 12/18/2023 | | |
| Attorney Dkt #: | 0234-0893PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18543182
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Filing Dt:
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12/18/2023
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Publication #:
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Pub Dt:
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05/09/2024
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Title:
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ADHESIVE COMPOSITION AND FILM ADHESIVE, AND SEMICONDUCTOR PACKAGE USING FILM ADHESIVE AND PRODUCING METHOD THEREOF
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Assignee
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| 6-4, OTEMACHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8322 |
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Correspondence name and address
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BIRCH STEWART KOLASH & BIRCH LLP
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8110 GATEHOUSE ROAD, SUITE 100E
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FALLSCHURCH, VA 22042
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06/19/2024 04:03 PM
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