Patent Assignment Details
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Reel/Frame: | 010699/0084 | |
| Pages: | 3 |
| | Recorded: | 03/16/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/26/2001
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Application #:
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09526641
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Filing Dt:
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03/16/2000
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Title:
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Highly conductive molding compounds and fuel cell bipolar plates comprising these compounds
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Assignee
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RT. 20 AND HARMON ROAD |
P.O. BOX 281 |
N. KINGSVILLE, OHIO 44068 |
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Correspondence name and address
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HUDAK & SHUNK CO., L.P.A.
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LAURA F. SHUNK
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SUITE 808
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7 WEST BOWERY STREET
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AKRON, OH 44308-1133
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