Patent Assignment Details
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Reel/Frame: | 005040/0085 | |
| Pages: | 1 |
| | Recorded: | 02/08/1989 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/07/1989
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Application #:
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07307512
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Filing Dt:
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02/08/1989
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Title:
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DIE BONDING APPARATUS
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Assignee
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2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU |
TOKYO, JAPAN |
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Correspondence name and address
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LEYDIG, VOIT & MAYER
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655 15TH STREET, N. W., STE. 520
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WASHINGTON, DC 20005
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