Total properties:
19
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17054167
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Filing Dt:
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11/10/2020
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Publication #:
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Pub Dt:
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08/12/2021
| | | | |
Title:
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RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17255980
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Filing Dt:
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12/23/2020
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Publication #:
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Pub Dt:
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04/22/2021
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Title:
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ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR PRODUCING THE ANISOTROPIC CONDUCTIVE FILM INCLUDING A BASE MATERIAL HAVING RECESSES AND SOLDER PARTICLES FORMED INSIDE THE RECESSES
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17255982
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Filing Dt:
|
12/23/2020
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Publication #:
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Pub Dt:
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04/22/2021
| | | | |
Title:
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SOLDER PARTICLES
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17255988
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Filing Dt:
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12/23/2020
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Publication #:
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Pub Dt:
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07/29/2021
| | | | |
Title:
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SOLDER PARTICLES AND METHOD FOR PRODUCING SOLDER PARTICLES
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17261571
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Filing Dt:
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01/20/2021
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Publication #:
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Pub Dt:
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08/26/2021
| | | | |
Title:
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RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE
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Patent #:
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Issue Dt:
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04/23/2024
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Application #:
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17261877
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Filing Dt:
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01/21/2021
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Publication #:
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Pub Dt:
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09/30/2021
| | | | |
Title:
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ACRYLIC RESIN, PRODUCING METHOD THEREOF, RESIN COMPOSITION SET, HEAT STORAGE MATERIAL, AND ARTICLE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17262207
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Filing Dt:
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01/22/2021
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Publication #:
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Pub Dt:
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09/23/2021
| | | | |
Title:
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METHOD FOR DECOMPOSING FLAVONOID GLYCOSIDE AND METHOD FOR PRODUCING FLAVONOID
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Patent #:
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Issue Dt:
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01/30/2024
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Application #:
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17263141
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Filing Dt:
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01/25/2021
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Publication #:
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Pub Dt:
|
06/24/2021
| | | | |
Title:
|
METHOD FOR DECOMPOSING FLAVONOID GLYCOSIDE AND METHOD FOR PRODUCING FLAVONOID
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|
|
Patent #:
|
|
Issue Dt:
|
08/27/2024
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Application #:
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17274788
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Filing Dt:
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03/10/2021
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Publication #:
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Pub Dt:
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02/17/2022
| | | | |
Title:
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ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
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Patent #:
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NONE
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Issue Dt:
|
|
Application #:
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17279594
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Filing Dt:
|
03/25/2021
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Publication #:
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Pub Dt:
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12/23/2021
| | | | |
Title:
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ORGANIC ELECTRONIC MATERIAL AND USE THEREOF
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|
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Patent #:
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NONE
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Issue Dt:
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|
Application #:
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17279596
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Filing Dt:
|
03/25/2021
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Publication #:
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Pub Dt:
|
11/04/2021
| | | | |
Title:
|
ORGANIC ELECTRONIC MATERIAL AND ORGANIC ELECTRONIC ELEMENT
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|
|
Patent #:
|
|
Issue Dt:
|
02/06/2024
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Application #:
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17296986
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Filing Dt:
|
05/26/2021
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Publication #:
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|
Pub Dt:
|
01/27/2022
| | | | |
Title:
|
METHOD FOR PRODUCING BONDED OBJECT AND SEMICONDUCTOR DEVICE AND COPPER BONDING PASTE
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|
|
Patent #:
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NONE
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Issue Dt:
|
|
Application #:
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17422440
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Filing Dt:
|
07/12/2021
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Publication #:
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|
Pub Dt:
|
03/24/2022
| | | | |
Title:
|
ANISOTROPIC HEAT-CONDUCTING RESIN MEMBER AND HEAT-TRANSMITTING SUBSTRATE
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|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
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17437412
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Filing Dt:
|
09/08/2021
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Publication #:
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Pub Dt:
|
05/26/2022
| | | | |
Title:
|
CURABLE COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE
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|
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Patent #:
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NONE
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Issue Dt:
|
|
Application #:
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17601426
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Filing Dt:
|
10/04/2021
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Publication #:
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|
Pub Dt:
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06/23/2022
| | | | |
Title:
|
COATING LIQUID, COMPOSITE MATERIAL, AND COATING FILM
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|
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Patent #:
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NONE
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Issue Dt:
|
|
Application #:
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17613493
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Filing Dt:
|
11/23/2021
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Publication #:
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Pub Dt:
|
08/04/2022
| | | | |
Title:
|
COMPOUND, MOLDED ARTICLE, AND CURED PRODUCT
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|
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Patent #:
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NONE
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Issue Dt:
|
|
Application #:
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17642229
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Filing Dt:
|
03/11/2022
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Publication #:
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Pub Dt:
|
10/06/2022
| | | | |
Title:
|
ENCAPSULATING MATERIAL FOR COMPRESSION MOLDING AND ELECTRONIC PART DEVICE
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|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
17791534
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Filing Dt:
|
07/08/2022
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Publication #:
|
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Pub Dt:
|
03/23/2023
| | | | |
Title:
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RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT APPARATUS
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|
|
Patent #:
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NONE
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Issue Dt:
|
|
Application #:
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17925014
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Filing Dt:
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11/14/2022
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Publication #:
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Pub Dt:
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06/15/2023
| | | | |
Title:
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PRIMER, SUBSTRATE EQUIPPED WITH PRIMER LAYER, METHOD FOR PRODUCING SUBSTRATE EQUIPPED WITH PRIMER LAYER, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
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