Patent Assignment Details
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Reel/Frame: | 007932/0087 | |
| Pages: | 2 |
| | Recorded: | 03/26/1996 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/18/1997
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Application #:
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08622671
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Filing Dt:
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03/26/1996
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Title:
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3D STACK OF IC CHIPS HAVING LEADS REACHED BY VIAS THROUGH PASSIVATION COVERING ACCESS PLANE
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Assignee
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BLDG. 3, SUITE 208 |
3001 REDHILL AVE. |
COSTA MESA, CALIFORNIA 92626 |
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Correspondence name and address
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THOMAS J. PLANTE
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11 SOLANA
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IRVINE, CA 92715
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