Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 025000/0087 | |
| Pages: | 6 |
| | Recorded: | 08/30/2010 | | |
| Conveyance: | CORRECTIVE COVER SHEET TO CORRECT PATENT NUMBER 3365069 THAT WAS PREVIOUSLY RECORDED ON REEL 021450 FRAME 0788. |
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Total properties:
3
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Patent #:
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Issue Dt:
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06/26/2001
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Application #:
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09526641
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Filing Dt:
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03/16/2000
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Title:
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Highly conductive molding compounds and fuel cell bipolar plates comprising these compounds
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Patent #:
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Issue Dt:
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08/20/2002
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Application #:
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09849629
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Filing Dt:
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05/04/2001
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Publication #:
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Pub Dt:
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12/06/2001
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Title:
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HIGHLY CONDUCTIVE MOLDING COMPOUNDS FOR USE AS FUEL CELL PLATES AND THE RESULTING PRODUCTS
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Patent #:
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Issue Dt:
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04/02/2002
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Application #:
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09879327
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Filing Dt:
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06/12/2001
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Publication #:
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Pub Dt:
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01/17/2002
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Title:
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Process of injection molding highly conductive molding compounds and an apparatus for this process
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Assignee
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| 1310 SOUTH VALLEY CENTER DRIVE |
| BAY CITY, MICHIGAN 48706-9798 |
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Correspondence name and address
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HUDAK SHUNK & FARINE CO. LPA
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LAURA F. SHUNK
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2020 FRONT STREET, SUITE 307
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CUYAHOGA FALLS, OH 44221
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