Patent Assignment Details
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| Reel/Frame: | 047541/0087 | |
| Pages: | 4 |
| | Recorded: | 11/19/2018 | | |
| Attorney Dkt #: | 5523/0166PUS11 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16194023
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Filing Dt:
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11/16/2018
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Publication #:
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Pub Dt:
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03/21/2019
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Title:
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INTERCONNECT SUBSTRATE HAVING STRESS MODULATOR AND FLIP CHIP ASSEMBLY THEREOF
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Assignee
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| 3F., NO. 157, LI-TE RD., PEITOU DIST. |
| TAIPEI CITY, TAIWAN 11259 |
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Correspondence name and address
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MUNCY, GEISSLER, OLDS & LOWE, PC
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4000 LEGATO RD., SUITE 310
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FAIRFAX, VA 22033
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09/23/2024 01:08 PM
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