Patent Assignment Details
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Reel/Frame: | 012865/0088 | |
| Pages: | 4 |
| | Recorded: | 04/30/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/30/1999
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Application #:
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09087367
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Filing Dt:
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05/29/1998
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Title:
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GOLD-BASED ALLOY FOR BONDING WIRE OF SEMICONDUCTOR DEVICE
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Assignee
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316-2 KEUMU, POGOK-MYUN, YONGIN-SI |
KYONGKI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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COOPER & DUNHAM LLP
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RICHARD S. MILNER
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1185 AVENUE OF THE AMERICAS
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NEW YORK, NY 10036
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