Patent Assignment Details
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Reel/Frame: | 020200/0089 | |
| Pages: | 4 |
| | Recorded: | 12/05/2007 | | |
Attorney Dkt #: | HK9366US.2 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11950921
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Filing Dt:
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12/05/2007
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Publication #:
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Pub Dt:
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09/04/2008
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Title:
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IMAGE SENSOR CHIP SCALE PACKAGE HAVING INTER-ADHESION WITH GAP AND METHOD OF THE SAME
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Assignee
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NO. 65, GUANGFU N. RD. |
HUKOU TOWNSHIP |
HSINCHU COUNTY, TAIWAN 303 |
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Correspondence name and address
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MICHAEL A. JAFFE
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6151 WILSON MILLS ROAD
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HIGHLAND PLACE - SUITE 310
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HIGHLAND HEIGHTS, OH 44143
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