Patent Assignment Details
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Reel/Frame: | 014086/0091 | |
| Pages: | 2 |
| | Recorded: | 05/16/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/24/2004
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Application #:
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10438981
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Filing Dt:
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05/16/2003
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Publication #:
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Pub Dt:
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11/20/2003
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Title:
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ENHANCEMENT OF WIRE BONDABILITY IN SEMICONDUCTOR DEVICE PACKAGE
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Assignee
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1-1 SHOWA-CHO |
KARIYA-CITY, AICHI-PREF, JAPAN 448-8661 |
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Correspondence name and address
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POSZ & BETHARDS, PLC
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JAMES E. BARLOW
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11250 ROGER BACON DRIVE, SUITE 10
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RESTON, VA 20190
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