Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 023146/0091 | |
| Pages: | 3 |
| | Recorded: | 08/26/2009 | | |
| Attorney Dkt #: | PBUS080052 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/11/2011
|
Application #:
|
12547575
|
Filing Dt:
|
08/26/2009
|
|
Publication #:
|
|
Pub Dt:
|
09/30/2010
| | | | |
|
Title:
|
HIGH FREQUENCY FLIP CHIP PACKAGE PROCESS OF POLYMER SUBSTRATE AND STRUCTURE THEREOF
|
|
|
Assignee
|
|
|
|
|
| NO.1001, UNIVERSITY ROAD |
| HSINCHU, TAIWAN 300 |
|
|
Correspondence name and address
|
| |
HUNG-CHIH TSENG
|
| |
13611 NORTHBOURNE DR.
|
| |
CENTREVILLE, VA 20120
|
Search Results as of:
05/23/2024 10:46 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
