Patent Assignment Details
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| Reel/Frame: | 060599/0091 | |
| Pages: | 14 |
| | Recorded: | 07/22/2022 | | |
| Attorney Dkt #: | 14261.0209-00000 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/30/2024
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Application #:
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17753298
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Filing Dt:
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02/25/2022
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Publication #:
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Pub Dt:
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09/01/2022
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Title:
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METHOD, APPARATUS, AND SYSTEM FOR WAFER GROUNDING
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Assignee
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| P.O. BOX 324 |
| VELDHOVEN, NETHERLANDS 5500 AH |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW, GARRETT & DUNNER LLP
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901 NEW YORK AVENUE, NW
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WASHINGTON, DC 20001
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11/10/2024 01:02 PM
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