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Patent Assignment Details
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Reel/Frame:015134/0092   Pages: 3
Recorded: 03/25/2004
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 2
1
Patent #:
Issue Dt:
12/08/1998
Application #:
08808019
Filing Dt:
03/03/1997
Title:
LOW-TEMPERATURE FIRED CERAMIC CIRCUIT SUBSTRATE WITH IMPROVED AG-AU CONNECTION RELIABILITY
2
Patent #:
Issue Dt:
03/28/2000
Application #:
08810089
Filing Dt:
03/03/1997
Title:
METHOD OF FABRICATING CERAMIC MULTILAYER SUBSTRATE
Assignor
1
Exec Dt:
03/23/2004
Assignee
1
26-10, TENJIN 2-CHOME
NAGAOKAKYO-SHI
KYOTO, JAPAN 614-8555
Correspondence name and address
FOLEY & LARDNER LLP
RICHARD L. SCHWAAB
3000K STREET, N.W., SUITE 500
WASHINGTON, DC 20007-5143

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