Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 057749/0095 | |
| Pages: | 16 |
| | Recorded: | 10/07/2021 | | |
Attorney Dkt #: | 1884.533US1 |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE THE NAME AND EXECUTION DATE FOR THE 7TH INVENTOR PREVIOUSLY RECORDED AT REEL: 051929 FRAME: 0391. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16141415
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Filing Dt:
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09/25/2018
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Publication #:
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Pub Dt:
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03/26/2020
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Title:
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STACKED WIRE-BOND DICE ATTACHED BY PILLARS OR BUMPS ABOVE A FLIP-CHIP DIE ON A SEMICONDUCTOR PACKAGE SUBSTRATE
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Assignee
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2200 MISSION COLLEGE BLVD. |
SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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SCHWEGMAN LUNDBERG & WOESSNER, P.A.
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P.O. BOX 2938
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MINNEAPOLIS, MN 55402
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