Patent Assignment Details
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Reel/Frame: | 013275/0096 | |
| Pages: | 6 |
| | Recorded: | 09/05/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/24/2004
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Application #:
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10236619
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Filing Dt:
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09/06/2002
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Publication #:
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Pub Dt:
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03/11/2004
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Title:
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THINNED SEMICONDUCTOR WAFER AND DIE AND CORRESPONDING METHOD
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Assignee
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1303 EAST ALGONQUIN ROAD |
LAW DEPARTMENT |
SCHAUMBURG, ILLINOIS 60196 |
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Correspondence name and address
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FITCH, EVEN, TABIN & FLANNERY
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STEPHEN S. FAVAKEH
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STE. 1600
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120 S. LASALEE ST.
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CHICAGO, IL 60603
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