Patent Assignment Details
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Reel/Frame: | 014174/0096 | |
| Pages: | 2 |
| | Recorded: | 06/10/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10458941
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Filing Dt:
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06/10/2003
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Publication #:
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Pub Dt:
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12/16/2004
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Title:
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Chip package structure
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Assignee
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NO. 84, TAIHO RD., CHUPEI |
HSINCHU HSIEN, TAIWAN R.O.C. |
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Correspondence name and address
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PRO-TECHTOR INTERNATIONAL
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KEITH KLINE
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20775 NORADA COURT
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SARATOGA, CA 95070-3018
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