Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 067064/0096 | |
| Pages: | 5 |
| | Recorded: | 04/10/2024 | | |
| Attorney Dkt #: | 3047.0600005[17-108904US] |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18196039
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Filing Dt:
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05/11/2023
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Publication #:
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Pub Dt:
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09/07/2023
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Title:
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Integrated Assemblies Having Thicker Semiconductor Material Along One Region of a Conductive Structure than Along Another Region, and Methods of Forming Integrated Assemblies
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Assignee
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| 8000 SOUTH FEDERAL WAY |
| BOISE, IDAHO 83716-9632 |
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Correspondence name and address
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BROOKS CAMERON & HUEBSCH PLLC
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1201 MARQUETTE AVENUE SOUTH, SUITE 400
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MINNEAPOLIS, MN 55403
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09/23/2024 05:19 PM
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