Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 021312/0097 | |
| Pages: | 5 |
| | Recorded: | 07/30/2008 | | |
| Attorney Dkt #: | 2413.0040000 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12182180
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Filing Dt:
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07/30/2008
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Publication #:
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Pub Dt:
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08/27/2009
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Title:
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JOINT RELIABILITY OF SOLDER JOINT BETWEEN Sn-yAg SOLDER AND Ni-P UNDER BUMP METALLIC LAYER BY COBALT ADDITION
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Assignee
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| 373-1, GUSUNG-DONG, YUSEONG-KU |
| DAEJEON, KOREA, REPUBLIC OF 305-701 |
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Correspondence name and address
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GEORGE S. BARDMESSER
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910 17TH STREET, N.W., SUITE 800
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WASHINGTON, DC 20006
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