Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 012588/0098 | |
| Pages: | 8 |
| | Recorded: | 02/11/2002 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE SECOND INVENTOR FIRST NAME, PREVIOUSLY RECORDED AT REEL 012112, FRAME 0088. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09935796
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Filing Dt:
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08/24/2001
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Publication #:
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Pub Dt:
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06/20/2002
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Title:
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Bonding pad structure to avoid probing damage
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Assignee
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| CHUTUNG |
| NO. 195, SEC. 4 CHUNG HSING ROAD |
| HSINCHU, TAIWAN |
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Correspondence name and address
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RABIN & BERDO, P.C.
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STEVEN M. RABIN
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1101 14TH STREET, N.W.
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SUITE 500
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WASHINGTON, D.C. 20005
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