Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 038307/0098 | |
| Pages: | 5 |
| | Recorded: | 04/18/2016 | | |
| Attorney Dkt #: | SA25444EC-US02 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/18/2017
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Application #:
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15131555
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Filing Dt:
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04/18/2016
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Publication #:
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Pub Dt:
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05/18/2017
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Title:
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SEMICONDUCTOR DEVICE PACKAGE, ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICES USING WAFER LEVEL CHIP SCALE PACKAGE TECHNOLOGY
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Assignee
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| 6501 WILLIAM CANNON DRIVE WEST |
| AUSTIN, TEXAS 78735 |
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Correspondence name and address
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NXP
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6501 WILLIAM CANNON DRIVE WEST
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AUSTIN, TX 78735
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