Patent Assignment Details
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Reel/Frame: | 020269/0100 | |
| Pages: | 5 |
| | Recorded: | 12/03/2007 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11999166
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Filing Dt:
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12/03/2007
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Publication #:
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Pub Dt:
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06/05/2008
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Title:
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Packing case with buffers for holding multi-size substrates of display device
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Assignee
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NO. 160 KESYUE RD., CHU-NAN SITE, HSINCHU SCIENCE PARK |
CHU-NAN 350 |
MIAO-LI COUNTY, TAIWAN ROC |
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Correspondence name and address
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WEI TE CHUNG (FOXCONN INTERNATIONAL, INC
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1650 MEMOREX DRIVE,
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SANTA CLARA, CA 95050
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