Patent Assignment Details
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| Reel/Frame: | 045594/0100 | |
| Pages: | 6 |
| | Recorded: | 04/19/2018 | | |
| Attorney Dkt #: | 18026 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/01/2022
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Application #:
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15769728
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Filing Dt:
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04/19/2018
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Publication #:
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Pub Dt:
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11/01/2018
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Title:
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WORKPIECE CONVEYANCE APPARATUS, SEMICONDUCTOR MANUFACTURING APPARATUS, AND WORKPIECE CONVEYANCE METHOD
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Assignee
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| 11-1, OSAKI 1-CHOME |
| SHINAGAWA-KU, TOKYO, JAPAN 1410032 |
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Correspondence name and address
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HOLTZ, HOLTZ, & VOLEK PC
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630 NINTH AVENUE, SUITE 1010
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NEW YORK, NY 10036-3744
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