Patent Assignment Details
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| Reel/Frame: | 022727/0102 | |
| Pages: | 17 |
| | Recorded: | 05/22/2009 | | |
| Attorney Dkt #: | 002.D177DD |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYANCE TYPE, RECEIVING PARTY AND EXECUTION DATE PREVIOUSLY RECORDED ON REEL 011079 FRAME 0719. ASSIGNOR(S) HEREBY CONFIRMS THE CONVEYANCE TYPE IS NAME CHANGE, RECEIVING PARTY IS HYUNDAI MICROELECTRONICS CO., LTD AND DATE IS 07/26/1999. |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/14/2000
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Application #:
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08956387
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Filing Dt:
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10/23/1997
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Title:
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METHOD FOR FORMING METAL LINE OF SEMICONDUCTOR DEVICE
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Assignee
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| 1, HYANGJEONG-DONG, HUNGDOK-GU |
| CHONGJU-SHI, KOREA, REPUBLIC OF |
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Correspondence name and address
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OMIKRON IP LAW GROUP
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525 1ST ST, SUITE 112
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LAKE OSWEGO, OR 97034
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