Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 025606/0102 | |
| Pages: | 6 |
| | Recorded: | 01/10/2011 | | |
Attorney Dkt #: | 062987-0101 |
Conveyance: | RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10762666
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Filing Dt:
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01/22/2004
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Publication #:
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Pub Dt:
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08/05/2004
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Title:
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Method and apparatus for the use of self-assembled nanowires for the removal of heat from integrated circuits
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Patent #:
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Issue Dt:
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02/02/2010
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Application #:
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11443669
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Filing Dt:
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05/30/2006
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Publication #:
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Pub Dt:
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12/14/2006
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Title:
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IN-CHIP STRUCTURES AND METHODS FOR REMOVING HEAT FROM INTEGRATED CIRCUITS
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Assignees
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1244 REAMWOOD |
SUNNYVALE, CALIFORNIA 94089 |
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1275 REAMWOOD AVENUE |
SUNNYVALE, CALIFORNIA 94089 |
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Correspondence name and address
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STEPHEN B. MAEBIUS
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FOLEY & LARDNER LLP
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3000 K STREET, 6TH FLOOR
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WASHINGTON, DC 20007
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