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Patent Assignment Details
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Reel/Frame:025606/0102   Pages: 6
Recorded: 01/10/2011
Attorney Dkt #:062987-0101
Conveyance: RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Total properties: 2
1
Patent #:
NONE
Issue Dt:
Application #:
10762666
Filing Dt:
01/22/2004
Publication #:
Pub Dt:
08/05/2004
Title:
Method and apparatus for the use of self-assembled nanowires for the removal of heat from integrated circuits
2
Patent #:
Issue Dt:
02/02/2010
Application #:
11443669
Filing Dt:
05/30/2006
Publication #:
Pub Dt:
12/14/2006
Title:
IN-CHIP STRUCTURES AND METHODS FOR REMOVING HEAT FROM INTEGRATED CIRCUITS
Assignors
1
Exec Dt:
09/30/2009
2
Exec Dt:
09/30/2009
3
Exec Dt:
09/30/2009
4
Exec Dt:
09/30/2009
5
Exec Dt:
09/30/2009
Assignees
1
1244 REAMWOOD
SUNNYVALE, CALIFORNIA 94089
2
1275 REAMWOOD AVENUE
SUNNYVALE, CALIFORNIA 94089
Correspondence name and address
STEPHEN B. MAEBIUS
FOLEY & LARDNER LLP
3000 K STREET, 6TH FLOOR
WASHINGTON, DC 20007

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