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Reel/Frame:041675/0105   Pages: 31
Recorded: 02/10/2017
Attorney Dkt #:065664/0012
Conveyance: SUPPLEMENT NO. 3 TO PATENT SECURITY AGREEMENT
Total properties: 303
Page 2 of 4
Pages: 1 2 3 4
1
Patent #:
Issue Dt:
11/15/2016
Application #:
14289936
Filing Dt:
05/29/2014
Publication #:
Pub Dt:
12/03/2015
Title:
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
2
Patent #:
NONE
Issue Dt:
Application #:
14290987
Filing Dt:
05/30/2014
Publication #:
Pub Dt:
12/03/2015
Title:
CYLINDER-SHAPED STORAGE NODE WITH SINGLE-LAYER SUPPORTING STRUCTURE
3
Patent #:
Issue Dt:
04/07/2015
Application #:
14316972
Filing Dt:
06/27/2014
Publication #:
Pub Dt:
10/16/2014
Title:
VERTICAL PMOS FIELD EFFECT TRANSISTOR AND MANUFACTURING METHOD THEREOF
4
Patent #:
Issue Dt:
06/07/2016
Application #:
14495864
Filing Dt:
09/24/2014
Publication #:
Pub Dt:
03/24/2016
Title:
SAMPLE STACK STRUCTURE AND METHOD FOR PREPARING THE SAME
5
Patent #:
Issue Dt:
02/09/2016
Application #:
14504385
Filing Dt:
10/01/2014
Publication #:
Pub Dt:
12/03/2015
Title:
VERTICAL TRANSISTOR AND METHOD TO FORM VERTICAL TRANSISTOR CONTACT NODE
6
Patent #:
Issue Dt:
10/27/2015
Application #:
14505490
Filing Dt:
10/02/2014
Title:
SEMICONDUCTOR STRUCTURE
7
Patent #:
NONE
Issue Dt:
Application #:
14509151
Filing Dt:
10/08/2014
Publication #:
Pub Dt:
04/14/2016
Title:
TRANSISTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
8
Patent #:
Issue Dt:
07/19/2016
Application #:
14664932
Filing Dt:
03/23/2015
Title:
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
9
Patent #:
Issue Dt:
10/11/2016
Application #:
14667676
Filing Dt:
03/24/2015
Publication #:
Pub Dt:
09/29/2016
Title:
PROBE UNIT FOR TEST TOOLS AND METHOD OF MANUFACTURING THE SAME
10
Patent #:
Issue Dt:
10/11/2016
Application #:
14702771
Filing Dt:
05/04/2015
Publication #:
Pub Dt:
03/31/2016
Title:
NON-FLOATING VERTICAL TRANSISTOR STRUCTURE
11
Patent #:
NONE
Issue Dt:
Application #:
14714334
Filing Dt:
05/17/2015
Publication #:
Pub Dt:
11/17/2016
Title:
RECESS ARRAY DEVICE WITH REDUCED CONTACT RESISTANCE
12
Patent #:
Issue Dt:
07/26/2016
Application #:
14720830
Filing Dt:
05/24/2015
Title:
SPLIT CONTACT STRUCTURE AND FABRICATION METHOD THEREOF
13
Patent #:
Issue Dt:
09/27/2016
Application #:
14720840
Filing Dt:
05/25/2015
Title:
SILICON INTERPOSER AND FABRICATION METHOD THEREOF
14
Patent #:
Issue Dt:
08/07/2018
Application #:
14730231
Filing Dt:
06/03/2015
Publication #:
Pub Dt:
12/08/2016
Title:
SEMICONDUCTOR DEVICES INCLUDING DUMMY CHIPS
15
Patent #:
Issue Dt:
03/13/2018
Application #:
14731380
Filing Dt:
06/04/2015
Publication #:
Pub Dt:
12/08/2016
Title:
METHODS OF FABRICATING A SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING AT LEAST ONE REDISTRIBUTION LAYER
16
Patent #:
Issue Dt:
08/06/2019
Application #:
14731382
Filing Dt:
06/04/2015
Publication #:
Pub Dt:
12/08/2016
Title:
METHODS OF MANUFACTURING A MULTI-DEVICE PACKAGE
17
Patent #:
Issue Dt:
06/26/2018
Application #:
14731426
Filing Dt:
06/05/2015
Publication #:
Pub Dt:
12/08/2016
Title:
SEMICONDUCTOR STRUCTURE HAVING A PATTERNED SURFACE STRUCTURE AND SEMICONDUCTOR CHIPS INCLUDING SUCH STRUCTURES
18
Patent #:
NONE
Issue Dt:
Application #:
14735127
Filing Dt:
06/09/2015
Publication #:
Pub Dt:
12/15/2016
Title:
PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
19
Patent #:
Issue Dt:
09/19/2017
Application #:
14745464
Filing Dt:
06/21/2015
Publication #:
Pub Dt:
12/22/2016
Title:
SEMICONDUCTOR DEVICES COMPRISING GATE STRUCTURE SIDEWALLS HAVING DIFFERENT ANGLES
20
Patent #:
Issue Dt:
12/13/2016
Application #:
14745473
Filing Dt:
06/22/2015
Publication #:
Pub Dt:
12/22/2016
Title:
WAFER LEVEL PACKAGE AND FABRICATION METHOD THEREOF
21
Patent #:
Issue Dt:
10/18/2016
Application #:
14803100
Filing Dt:
07/19/2015
Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
22
Patent #:
Issue Dt:
09/20/2016
Application #:
14810415
Filing Dt:
07/27/2015
Title:
WAFER LEVEL PACKAGE HAVING REDISTRIBUTION LAYER AND FABRICATION METHOD THEREOF
23
Patent #:
Issue Dt:
01/16/2018
Application #:
14810492
Filing Dt:
07/28/2015
Publication #:
Pub Dt:
02/02/2017
Title:
ELECTROSTATIC CHUCK AND TEMPERATURE-CONTROL METHOD FOR THE SAME
24
Patent #:
Issue Dt:
01/10/2017
Application #:
14814524
Filing Dt:
07/31/2015
Publication #:
Pub Dt:
02/02/2017
Title:
MULTI-DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
25
Patent #:
Issue Dt:
03/27/2018
Application #:
14837802
Filing Dt:
08/27/2015
Publication #:
Pub Dt:
12/17/2015
Title:
METHOD AND APPARATUS PROVIDING PIXEL ARRAY HAVING AUTOMATIC LIGHT CONTROL PIXELS AND IMAGE CAPTURE PIXELS
26
Patent #:
Issue Dt:
08/15/2017
Application #:
14848357
Filing Dt:
09/09/2015
Publication #:
Pub Dt:
03/09/2017
Title:
MEMORY DEVICE AND FABRICATING METHOD THEREOF
27
Patent #:
Issue Dt:
01/09/2018
Application #:
14876600
Filing Dt:
10/06/2015
Publication #:
Pub Dt:
04/06/2017
Title:
SECURE SUBSYSTEM
28
Patent #:
Issue Dt:
06/28/2016
Application #:
14877889
Filing Dt:
10/07/2015
Title:
RECESS ARRAY DEVICE
29
Patent #:
Issue Dt:
09/20/2016
Application #:
14877949
Filing Dt:
10/08/2015
Title:
PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
30
Patent #:
Issue Dt:
08/29/2017
Application #:
14883632
Filing Dt:
10/15/2015
Publication #:
Pub Dt:
04/20/2017
Title:
WAFER LEVEL PACKAGE WITH TSV-LESS INTERPOSER
31
Patent #:
Issue Dt:
08/21/2018
Application #:
14923449
Filing Dt:
10/27/2015
Publication #:
Pub Dt:
04/27/2017
Title:
METHODS OF FORMING SEMICONDUCTOR PACKAGES INCLUDING MOLDING SEMICONDUCTOR CHIPS OF THE SEMICONDUCTOR PACKAGES
32
Patent #:
Issue Dt:
09/12/2017
Application #:
14927491
Filing Dt:
10/30/2015
Publication #:
Pub Dt:
12/29/2016
Title:
WAFER LEVEL PACKAGE AND FABRICATION METHOD THEREOF
33
Patent #:
Issue Dt:
11/06/2018
Application #:
14941665
Filing Dt:
11/16/2015
Publication #:
Pub Dt:
05/18/2017
Title:
METHODS OF FABRICATING A SEMICONDUCTOR STRUCTURE
34
Patent #:
Issue Dt:
10/10/2017
Application #:
14953025
Filing Dt:
11/27/2015
Publication #:
Pub Dt:
06/01/2017
Title:
FAULT ISOLATION SYSTEM AND METHOD FOR DETECTING FAULTS IN A CIRCUIT
35
Patent #:
Issue Dt:
03/28/2017
Application #:
14977645
Filing Dt:
12/22/2015
Title:
MULTI-CHIP SEMICONDUCTOR PACKAGE WITH VIA COMPONENTS AND METHOD FOR MANUFACTURING THE SAME
36
Patent #:
NONE
Issue Dt:
Application #:
14986729
Filing Dt:
01/04/2016
Publication #:
Pub Dt:
07/06/2017
Title:
OVERHEAD TRAVELING VEHICLE, TRANSPORTATION SYSTEM WITH THE SAME, AND METHOD OF OPERATING THE SAME
37
Patent #:
Issue Dt:
02/21/2017
Application #:
14989782
Filing Dt:
01/06/2016
Title:
FAN-OUT WAFER LEVEL PACKAGING AND MANUFACTURING METHOD THEREOF
38
Patent #:
Issue Dt:
07/11/2017
Application #:
14990776
Filing Dt:
01/07/2016
Publication #:
Pub Dt:
07/13/2017
Title:
MEMORY DEVICE AND FABRICATING METHOD THEREOF
39
Patent #:
Issue Dt:
01/09/2018
Application #:
14992013
Filing Dt:
01/10/2016
Publication #:
Pub Dt:
07/13/2017
Title:
WAFERS HAVING A DIE REGION AND A SCRIBE-LINE REGION ADJACENT TO THE DIE REGION
40
Patent #:
Issue Dt:
08/20/2019
Application #:
14993099
Filing Dt:
01/12/2016
Publication #:
Pub Dt:
07/13/2017
Title:
METHOD FOR FABRICATING A MEMORY DEVICE HAVING TWO CONTACTS
41
Patent #:
Issue Dt:
08/16/2016
Application #:
14996240
Filing Dt:
01/15/2016
Title:
METHOD FOR FORMING CELL CONTACT
42
Patent #:
Issue Dt:
11/06/2018
Application #:
15001255
Filing Dt:
01/20/2016
Publication #:
Pub Dt:
07/20/2017
Title:
SEMICONDUCTOR DEVICE
43
Patent #:
NONE
Issue Dt:
Application #:
15001267
Filing Dt:
01/20/2016
Publication #:
Pub Dt:
07/20/2017
Title:
DEVELOPMENT APPARATUS AND METHOD FOR DEVELOPING PHOTORESIST LAYER ON WAFER USING THE SAME
44
Patent #:
Issue Dt:
01/02/2018
Application #:
15002401
Filing Dt:
01/21/2016
Publication #:
Pub Dt:
07/27/2017
Title:
SEMICONDUCTOR MEMORY DEVICE HAVING ENLARGED CELL CONTACT AREA AND METHOD OF FABRICATING THE SAME
45
Patent #:
Issue Dt:
02/20/2018
Application #:
15002404
Filing Dt:
01/21/2016
Publication #:
Pub Dt:
07/27/2017
Title:
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE
46
Patent #:
Issue Dt:
08/29/2017
Application #:
15002405
Filing Dt:
01/21/2016
Publication #:
Pub Dt:
07/27/2017
Title:
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
47
Patent #:
NONE
Issue Dt:
Application #:
15003765
Filing Dt:
01/21/2016
Publication #:
Pub Dt:
07/27/2017
Title:
SEMICONDUCTOR STRUCTURE INCLUDING A CAPACITOR STRUCTURE AND FABRICATING METHOD THEREOF
48
Patent #:
NONE
Issue Dt:
Application #:
15003812
Filing Dt:
01/22/2016
Publication #:
Pub Dt:
07/27/2017
Title:
METHOD FOR MANUFACTURING A PACKAGE-ON-PACKAGE ASSEMBLY
49
Patent #:
Issue Dt:
04/11/2017
Application #:
15005794
Filing Dt:
01/25/2016
Publication #:
Pub Dt:
08/04/2016
Title:
SOLID STATE LIGHTING DEVICES WITH REDUCED CRYSTAL LATTICE DISLOCATIONS AND ASSOCIATED METHODS OF MANUFACTURING
50
Patent #:
Issue Dt:
03/06/2018
Application #:
15006134
Filing Dt:
01/26/2016
Publication #:
Pub Dt:
07/27/2017
Title:
METHOD OF FORMING PATTERNS
51
Patent #:
NONE
Issue Dt:
Application #:
15013995
Filing Dt:
02/02/2016
Publication #:
Pub Dt:
08/03/2017
Title:
THREE-WAY VALVE AND METHOD FOR USING THE SAME
52
Patent #:
Issue Dt:
02/21/2017
Application #:
15047632
Filing Dt:
02/19/2016
Title:
METHOD FOR FABRICATING WAFER LEVEL PACKAGE
53
Patent #:
Issue Dt:
04/04/2017
Application #:
15060577
Filing Dt:
03/03/2016
Title:
SEMICONDUCTOR PACKAGE WITH DOUBLE SIDE MOLDING
54
Patent #:
Issue Dt:
09/11/2018
Application #:
15060609
Filing Dt:
03/04/2016
Publication #:
Pub Dt:
09/07/2017
Title:
METHOD OF FORMING PATTERNS
55
Patent #:
Issue Dt:
02/14/2017
Application #:
15068649
Filing Dt:
03/14/2016
Title:
SEMICONDUCTOR PACKAGE WITH SIDEWALL-PROTECTED RDL INTERPOSER AND FABRICATION METHOD THEREOF
56
Patent #:
Issue Dt:
07/11/2017
Application #:
15069911
Filing Dt:
03/14/2016
Title:
METHOD OF FABRICATING A WAFER LEVEL PACKAGE
57
Patent #:
Issue Dt:
04/04/2017
Application #:
15069936
Filing Dt:
03/14/2016
Title:
METHOD OF FORMING PATTERNS
58
Patent #:
Issue Dt:
06/05/2018
Application #:
15077334
Filing Dt:
03/22/2016
Publication #:
Pub Dt:
07/14/2016
Title:
METHODS OF PROVIDING ACCESS TO I/O DEVICES
59
Patent #:
Issue Dt:
08/01/2017
Application #:
15098341
Filing Dt:
04/14/2016
Title:
SEMICONDUCTOR PACKAGE WITH MULTIPLE COPLANAR INTERPOSERS
60
Patent #:
Issue Dt:
09/06/2016
Application #:
15134396
Filing Dt:
04/21/2016
Title:
PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
61
Patent #:
Issue Dt:
09/12/2017
Application #:
15135539
Filing Dt:
04/21/2016
Title:
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
62
Patent #:
Issue Dt:
02/28/2017
Application #:
15137596
Filing Dt:
04/25/2016
Publication #:
Pub Dt:
10/27/2016
Title:
MULTI-JUNCTION SOLID STATE TRANSDUCER DEVICES FOR DIRECT AC POWER AND ASSOCIATED SYSTEMS AND METHODS
63
Patent #:
Issue Dt:
01/30/2018
Application #:
15151503
Filing Dt:
05/11/2016
Publication #:
Pub Dt:
11/16/2017
Title:
SEMICONDUCTOR MEMORY DEVICE HAVING COPLANAR DIGIT LINE CONTACTS AND STORAGE NODE CONTACTS IN MEMORY ARRAY AND METHOD FOR FABRICATING THE SAME
64
Patent #:
Issue Dt:
10/10/2017
Application #:
15155090
Filing Dt:
05/16/2016
Title:
METHOD FOR FORMING A PATTERNED LAYER
65
Patent #:
Issue Dt:
08/15/2017
Application #:
15219265
Filing Dt:
07/25/2016
Title:
CONDUCTIVE PADS FORMING METHOD
66
Patent #:
Issue Dt:
10/10/2017
Application #:
15242594
Filing Dt:
08/21/2016
Title:
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
67
Patent #:
Issue Dt:
01/02/2018
Application #:
15253894
Filing Dt:
09/01/2016
Publication #:
Pub Dt:
07/27/2017
Title:
METHOD OF FABRICATING SEMICONDUCTOR MEMORY DEVICE HAVING ENLARGED CELL CONTACT AREA
68
Patent #:
Issue Dt:
05/29/2018
Application #:
15262956
Filing Dt:
09/12/2016
Publication #:
Pub Dt:
12/29/2016
Title:
SOLID STATE LIGHTING DEVICES WITH ACCESSIBLE ELECTRODES AND METHODS OF MANUFACTURING
69
Patent #:
Issue Dt:
11/10/2020
Application #:
15286582
Filing Dt:
10/06/2016
Publication #:
Pub Dt:
04/12/2018
Title:
MICROELECTRONIC PACKAGE UTILIZING EMBEDDED BRIDGE THROUGH-SILICON-VIA INTERCONNECT COMPONENT AND RELATED METHODS
70
Patent #:
Issue Dt:
12/22/2020
Application #:
15291086
Filing Dt:
10/12/2016
Publication #:
Pub Dt:
04/12/2018
Title:
WAFER LEVEL PACKAGE UTILIZING MOLDED INTERPOSER
71
Patent #:
NONE
Issue Dt:
Application #:
15296053
Filing Dt:
10/18/2016
Publication #:
Pub Dt:
04/19/2018
Title:
SYSTEM AND METHOD FOR DETECTING FAULT EVENTS
72
Patent #:
Issue Dt:
10/10/2017
Application #:
15296058
Filing Dt:
10/18/2016
Publication #:
Pub Dt:
09/14/2017
Title:
SEMICONDUCTOR PACKAGE WITH SIDEWALL-PROTECTED RDL INTERPOSER
73
Patent #:
Issue Dt:
11/19/2019
Application #:
15298131
Filing Dt:
10/19/2016
Publication #:
Pub Dt:
02/09/2017
Title:
SOLID STATE OPTOELECTRONIC DEVICE WITH PLATED SUPPORT SUBSTRATE
74
Patent #:
Issue Dt:
06/26/2018
Application #:
15298156
Filing Dt:
10/19/2016
Publication #:
Pub Dt:
04/19/2018
Title:
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS AND MOLDED UNDERFILL
75
Patent #:
Issue Dt:
10/15/2019
Application #:
15312010
Filing Dt:
11/17/2016
Publication #:
Pub Dt:
08/09/2018
Title:
VOLTAGE GENERATION CIRCUIT
76
Patent #:
Issue Dt:
01/23/2018
Application #:
15333507
Filing Dt:
10/25/2016
Publication #:
Pub Dt:
02/09/2017
Title:
OUTPUT BUFFER CIRCUIT WITH LOW SUB-THRESHOLD LEAKAGE CURRENT
77
Patent #:
Issue Dt:
08/06/2019
Application #:
15333774
Filing Dt:
10/25/2016
Publication #:
Pub Dt:
02/09/2017
Title:
MEMORY CELLS INCLUDING A METAL CHALCOGENIDE MATERIAL AND RELATED METHODS
78
Patent #:
Issue Dt:
05/22/2018
Application #:
15334069
Filing Dt:
10/25/2016
Publication #:
Pub Dt:
02/09/2017
Title:
METHOD OF ASSEMBLY SEMICONDUCTOR DEVICE WITH THROUGH-PACKAGE INTERCONNECT
79
Patent #:
Issue Dt:
08/20/2019
Application #:
15334186
Filing Dt:
10/25/2016
Publication #:
Pub Dt:
02/09/2017
Title:
Memory Cells and Methods of Forming Memory Cells
80
Patent #:
Issue Dt:
05/30/2017
Application #:
15335259
Filing Dt:
10/26/2016
Title:
Methods of Forming Integrated Circuitry
81
Patent #:
Issue Dt:
08/14/2018
Application #:
15336071
Filing Dt:
10/27/2016
Publication #:
Pub Dt:
05/03/2018
Title:
APPARATUSES AND METHODS FOR SINGLE LEVEL CELL CACHING
82
Patent #:
Issue Dt:
12/18/2018
Application #:
15338154
Filing Dt:
10/28/2016
Publication #:
Pub Dt:
05/03/2018
Title:
APPARATUSES INCLUDING MEMORY CELLS AND METHODS OF OPERATION OF SAME
83
Patent #:
Issue Dt:
10/22/2019
Application #:
15339290
Filing Dt:
10/31/2016
Publication #:
Pub Dt:
02/16/2017
Title:
METHOD FOR PACKAGING CIRCUITS
84
Patent #:
Issue Dt:
06/12/2018
Application #:
15339374
Filing Dt:
10/31/2016
Publication #:
Pub Dt:
02/16/2017
Title:
MEMORY DEVICES HAVING SOURCE LINES DIRECTLY COUPLED TO BODY REGIONS AND METHODS
85
Patent #:
Issue Dt:
09/24/2019
Application #:
15339693
Filing Dt:
10/31/2016
Publication #:
Pub Dt:
05/03/2018
Title:
SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIATED SYSTEMS AND METHODS
86
Patent #:
Issue Dt:
05/14/2019
Application #:
15339699
Filing Dt:
10/31/2016
Publication #:
Pub Dt:
02/16/2017
Title:
Methods of Forming and Using Fuses
87
Patent #:
Issue Dt:
12/25/2018
Application #:
15340682
Filing Dt:
11/01/2016
Publication #:
Pub Dt:
05/03/2018
Title:
CELL DISTURB PREVENTION USING A LEAKER DEVICE TO REDUCE EXCESS CHARGE FROM AN ELECTRONIC DEVICE
88
Patent #:
Issue Dt:
07/03/2018
Application #:
15340838
Filing Dt:
11/01/2016
Publication #:
Pub Dt:
05/03/2018
Title:
Methods of Forming an Array Comprising Pairs of Vertically Opposed Capacitors and Arrays Comprising Pairs of Vertically Opposed Capacitors
89
Patent #:
Issue Dt:
09/12/2017
Application #:
15340842
Filing Dt:
11/01/2016
Title:
METHODS OF FORMING AN ARRAY COMPRISING PAIRS OF VERTICALLY OPPOSED CAPACITORS AND ARRAYS COMPRISING PAIRS OF VERTICALLY OPPOSED CAPACITORS
90
Patent #:
Issue Dt:
10/23/2018
Application #:
15341410
Filing Dt:
11/02/2016
Publication #:
Pub Dt:
02/23/2017
Title:
PROGRAM AND READ TRIM SETTING
91
Patent #:
Issue Dt:
03/20/2018
Application #:
15342124
Filing Dt:
11/03/2016
Title:
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
92
Patent #:
Issue Dt:
01/23/2018
Application #:
15342255
Filing Dt:
11/03/2016
Publication #:
Pub Dt:
03/16/2017
Title:
ACCESS LINE MANAGEMENT IN A MEMORY DEVICE
93
Patent #:
Issue Dt:
11/13/2018
Application #:
15342287
Filing Dt:
11/03/2016
Publication #:
Pub Dt:
03/16/2017
Title:
SENSE OPERATION FLAGS IN A MEMORY DEVICE
94
Patent #:
Issue Dt:
07/10/2018
Application #:
15344211
Filing Dt:
11/04/2016
Publication #:
Pub Dt:
05/10/2018
Title:
WIRING WITH EXTERNAL TERMINAL
95
Patent #:
Issue Dt:
12/25/2018
Application #:
15344893
Filing Dt:
11/07/2016
Publication #:
Pub Dt:
02/23/2017
Title:
BONDING PADS WITH THERMAL PATHWAYS
96
Patent #:
Issue Dt:
04/10/2018
Application #:
15345636
Filing Dt:
11/08/2016
Publication #:
Pub Dt:
03/16/2017
Title:
MAGNETIC TUNNEL JUNCTIONS, METHODS USED WHILE FORMING MAGNETIC TUNNEL JUNCTIONS, AND METHODS OF FORMING MAGNETIC TUNNEL JUNCTIONS
97
Patent #:
Issue Dt:
10/01/2019
Application #:
15345783
Filing Dt:
11/08/2016
Publication #:
Pub Dt:
05/10/2018
Title:
MEMORY OPERATIONS ON DATA
98
Patent #:
Issue Dt:
04/16/2019
Application #:
15345862
Filing Dt:
11/08/2016
Publication #:
Pub Dt:
05/10/2018
Title:
MEMORY MANAGEMENT
99
Patent #:
Issue Dt:
05/12/2020
Application #:
15345919
Filing Dt:
11/08/2016
Publication #:
Pub Dt:
05/10/2018
Title:
DATA RELOCATION IN HYBRID MEMORY
100
Patent #:
Issue Dt:
11/26/2019
Application #:
15346526
Filing Dt:
11/08/2016
Publication #:
Pub Dt:
02/23/2017
Title:
COMPARISON OPERATIONS IN MEMORY
Assignor
1
Exec Dt:
01/24/2017
Assignee
1
1300 THAMES STREET
4TH FLOOR
BALTIMORE, MARYLAND 21231
Correspondence name and address
GENEVIEVE DORMENT, ESQ.
SIMPSON THACHER & BARTLETT LLP
425 LEXINGTON AVENUE
NEW YORK, NY 10017

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