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Patent #:
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Issue Dt:
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11/15/2016
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Application #:
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14289936
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Filing Dt:
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05/29/2014
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Publication #:
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Pub Dt:
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12/03/2015
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Title:
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SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14290987
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Filing Dt:
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05/30/2014
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Publication #:
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Pub Dt:
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12/03/2015
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Title:
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CYLINDER-SHAPED STORAGE NODE WITH SINGLE-LAYER SUPPORTING STRUCTURE
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Patent #:
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Issue Dt:
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04/07/2015
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Application #:
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14316972
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Filing Dt:
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06/27/2014
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Publication #:
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Pub Dt:
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10/16/2014
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Title:
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VERTICAL PMOS FIELD EFFECT TRANSISTOR AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
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06/07/2016
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Application #:
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14495864
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Filing Dt:
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09/24/2014
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Publication #:
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Pub Dt:
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03/24/2016
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Title:
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SAMPLE STACK STRUCTURE AND METHOD FOR PREPARING THE SAME
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Patent #:
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Issue Dt:
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02/09/2016
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Application #:
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14504385
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Filing Dt:
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10/01/2014
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Publication #:
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Pub Dt:
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12/03/2015
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Title:
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VERTICAL TRANSISTOR AND METHOD TO FORM VERTICAL TRANSISTOR CONTACT NODE
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Patent #:
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Issue Dt:
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10/27/2015
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Application #:
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14505490
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Filing Dt:
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10/02/2014
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Title:
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SEMICONDUCTOR STRUCTURE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14509151
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Filing Dt:
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10/08/2014
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Publication #:
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Pub Dt:
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04/14/2016
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Title:
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TRANSISTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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07/19/2016
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Application #:
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14664932
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Filing Dt:
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03/23/2015
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Title:
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SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
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10/11/2016
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Application #:
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14667676
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Filing Dt:
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03/24/2015
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Publication #:
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Pub Dt:
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09/29/2016
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Title:
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PROBE UNIT FOR TEST TOOLS AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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10/11/2016
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Application #:
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14702771
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Filing Dt:
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05/04/2015
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Publication #:
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Pub Dt:
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03/31/2016
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Title:
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NON-FLOATING VERTICAL TRANSISTOR STRUCTURE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14714334
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Filing Dt:
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05/17/2015
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Publication #:
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Pub Dt:
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11/17/2016
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Title:
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RECESS ARRAY DEVICE WITH REDUCED CONTACT RESISTANCE
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Patent #:
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Issue Dt:
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07/26/2016
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Application #:
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14720830
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Filing Dt:
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05/24/2015
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Title:
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SPLIT CONTACT STRUCTURE AND FABRICATION METHOD THEREOF
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Patent #:
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Issue Dt:
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09/27/2016
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Application #:
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14720840
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Filing Dt:
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05/25/2015
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Title:
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SILICON INTERPOSER AND FABRICATION METHOD THEREOF
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Patent #:
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Issue Dt:
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08/07/2018
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Application #:
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14730231
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Filing Dt:
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06/03/2015
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Publication #:
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Pub Dt:
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12/08/2016
| | | | |
Title:
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SEMICONDUCTOR DEVICES INCLUDING DUMMY CHIPS
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Patent #:
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Issue Dt:
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03/13/2018
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Application #:
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14731380
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Filing Dt:
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06/04/2015
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Publication #:
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Pub Dt:
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12/08/2016
| | | | |
Title:
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METHODS OF FABRICATING A SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING AT LEAST ONE REDISTRIBUTION LAYER
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Patent #:
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Issue Dt:
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08/06/2019
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Application #:
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14731382
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Filing Dt:
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06/04/2015
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Publication #:
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Pub Dt:
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12/08/2016
| | | | |
Title:
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METHODS OF MANUFACTURING A MULTI-DEVICE PACKAGE
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Patent #:
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Issue Dt:
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06/26/2018
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Application #:
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14731426
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Filing Dt:
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06/05/2015
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Publication #:
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Pub Dt:
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12/08/2016
| | | | |
Title:
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SEMICONDUCTOR STRUCTURE HAVING A PATTERNED SURFACE STRUCTURE AND SEMICONDUCTOR CHIPS INCLUDING SUCH STRUCTURES
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14735127
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Filing Dt:
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06/09/2015
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Publication #:
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Pub Dt:
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12/15/2016
| | | | |
Title:
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PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
|
09/19/2017
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Application #:
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14745464
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Filing Dt:
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06/21/2015
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Publication #:
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Pub Dt:
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12/22/2016
| | | | |
Title:
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SEMICONDUCTOR DEVICES COMPRISING GATE STRUCTURE SIDEWALLS HAVING DIFFERENT ANGLES
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Patent #:
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Issue Dt:
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12/13/2016
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Application #:
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14745473
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Filing Dt:
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06/22/2015
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Publication #:
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Pub Dt:
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12/22/2016
| | | | |
Title:
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WAFER LEVEL PACKAGE AND FABRICATION METHOD THEREOF
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Patent #:
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|
Issue Dt:
|
10/18/2016
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Application #:
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14803100
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Filing Dt:
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07/19/2015
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Title:
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Patent #:
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|
Issue Dt:
|
09/20/2016
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Application #:
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14810415
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Filing Dt:
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07/27/2015
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Title:
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WAFER LEVEL PACKAGE HAVING REDISTRIBUTION LAYER AND FABRICATION METHOD THEREOF
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Patent #:
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Issue Dt:
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01/16/2018
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Application #:
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14810492
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Filing Dt:
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07/28/2015
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Publication #:
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Pub Dt:
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02/02/2017
| | | | |
Title:
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ELECTROSTATIC CHUCK AND TEMPERATURE-CONTROL METHOD FOR THE SAME
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Patent #:
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Issue Dt:
|
01/10/2017
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Application #:
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14814524
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Filing Dt:
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07/31/2015
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Publication #:
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Pub Dt:
|
02/02/2017
| | | | |
Title:
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MULTI-DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
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|
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Patent #:
|
|
Issue Dt:
|
03/27/2018
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Application #:
|
14837802
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Filing Dt:
|
08/27/2015
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Publication #:
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Pub Dt:
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12/17/2015
| | | | |
Title:
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METHOD AND APPARATUS PROVIDING PIXEL ARRAY HAVING AUTOMATIC LIGHT CONTROL PIXELS AND IMAGE CAPTURE PIXELS
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Patent #:
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|
Issue Dt:
|
08/15/2017
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Application #:
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14848357
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Filing Dt:
|
09/09/2015
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Publication #:
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Pub Dt:
|
03/09/2017
| | | | |
Title:
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MEMORY DEVICE AND FABRICATING METHOD THEREOF
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|
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Patent #:
|
|
Issue Dt:
|
01/09/2018
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Application #:
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14876600
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Filing Dt:
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10/06/2015
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Publication #:
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Pub Dt:
|
04/06/2017
| | | | |
Title:
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SECURE SUBSYSTEM
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|
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Patent #:
|
|
Issue Dt:
|
06/28/2016
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Application #:
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14877889
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Filing Dt:
|
10/07/2015
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Title:
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RECESS ARRAY DEVICE
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Patent #:
|
|
Issue Dt:
|
09/20/2016
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Application #:
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14877949
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Filing Dt:
|
10/08/2015
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Title:
|
PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
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|
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Patent #:
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|
Issue Dt:
|
08/29/2017
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Application #:
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14883632
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Filing Dt:
|
10/15/2015
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Publication #:
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Pub Dt:
|
04/20/2017
| | | | |
Title:
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WAFER LEVEL PACKAGE WITH TSV-LESS INTERPOSER
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|
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Patent #:
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|
Issue Dt:
|
08/21/2018
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Application #:
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14923449
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Filing Dt:
|
10/27/2015
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Publication #:
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|
Pub Dt:
|
04/27/2017
| | | | |
Title:
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METHODS OF FORMING SEMICONDUCTOR PACKAGES INCLUDING MOLDING SEMICONDUCTOR CHIPS OF THE SEMICONDUCTOR PACKAGES
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|
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Patent #:
|
|
Issue Dt:
|
09/12/2017
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Application #:
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14927491
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Filing Dt:
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10/30/2015
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Publication #:
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|
Pub Dt:
|
12/29/2016
| | | | |
Title:
|
WAFER LEVEL PACKAGE AND FABRICATION METHOD THEREOF
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|
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Patent #:
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|
Issue Dt:
|
11/06/2018
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Application #:
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14941665
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Filing Dt:
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11/16/2015
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Publication #:
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|
Pub Dt:
|
05/18/2017
| | | | |
Title:
|
METHODS OF FABRICATING A SEMICONDUCTOR STRUCTURE
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|
|
Patent #:
|
|
Issue Dt:
|
10/10/2017
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Application #:
|
14953025
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Filing Dt:
|
11/27/2015
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Publication #:
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|
Pub Dt:
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06/01/2017
| | | | |
Title:
|
FAULT ISOLATION SYSTEM AND METHOD FOR DETECTING FAULTS IN A CIRCUIT
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|
|
Patent #:
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|
Issue Dt:
|
03/28/2017
|
Application #:
|
14977645
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Filing Dt:
|
12/22/2015
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Title:
|
MULTI-CHIP SEMICONDUCTOR PACKAGE WITH VIA COMPONENTS AND METHOD FOR MANUFACTURING THE SAME
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|
|
Patent #:
|
NONE
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Issue Dt:
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|
Application #:
|
14986729
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Filing Dt:
|
01/04/2016
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Publication #:
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Pub Dt:
|
07/06/2017
| | | | |
Title:
|
OVERHEAD TRAVELING VEHICLE, TRANSPORTATION SYSTEM WITH THE SAME, AND METHOD OF OPERATING THE SAME
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Patent #:
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|
Issue Dt:
|
02/21/2017
|
Application #:
|
14989782
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Filing Dt:
|
01/06/2016
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Title:
|
FAN-OUT WAFER LEVEL PACKAGING AND MANUFACTURING METHOD THEREOF
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|
|
Patent #:
|
|
Issue Dt:
|
07/11/2017
|
Application #:
|
14990776
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Filing Dt:
|
01/07/2016
|
Publication #:
|
|
Pub Dt:
|
07/13/2017
| | | | |
Title:
|
MEMORY DEVICE AND FABRICATING METHOD THEREOF
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|
|
Patent #:
|
|
Issue Dt:
|
01/09/2018
|
Application #:
|
14992013
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Filing Dt:
|
01/10/2016
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Publication #:
|
|
Pub Dt:
|
07/13/2017
| | | | |
Title:
|
WAFERS HAVING A DIE REGION AND A SCRIBE-LINE REGION ADJACENT TO THE DIE REGION
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|
|
Patent #:
|
|
Issue Dt:
|
08/20/2019
|
Application #:
|
14993099
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Filing Dt:
|
01/12/2016
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Publication #:
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|
Pub Dt:
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07/13/2017
| | | | |
Title:
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METHOD FOR FABRICATING A MEMORY DEVICE HAVING TWO CONTACTS
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|
|
Patent #:
|
|
Issue Dt:
|
08/16/2016
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Application #:
|
14996240
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Filing Dt:
|
01/15/2016
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Title:
|
METHOD FOR FORMING CELL CONTACT
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|
Patent #:
|
|
Issue Dt:
|
11/06/2018
|
Application #:
|
15001255
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Filing Dt:
|
01/20/2016
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Publication #:
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|
Pub Dt:
|
07/20/2017
| | | | |
Title:
|
SEMICONDUCTOR DEVICE
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|
|
Patent #:
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NONE
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Issue Dt:
|
|
Application #:
|
15001267
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Filing Dt:
|
01/20/2016
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Publication #:
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Pub Dt:
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07/20/2017
| | | | |
Title:
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DEVELOPMENT APPARATUS AND METHOD FOR DEVELOPING PHOTORESIST LAYER ON WAFER USING THE SAME
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|
|
Patent #:
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|
Issue Dt:
|
01/02/2018
|
Application #:
|
15002401
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Filing Dt:
|
01/21/2016
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Publication #:
|
|
Pub Dt:
|
07/27/2017
| | | | |
Title:
|
SEMICONDUCTOR MEMORY DEVICE HAVING ENLARGED CELL CONTACT AREA AND METHOD OF FABRICATING THE SAME
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|
|
Patent #:
|
|
Issue Dt:
|
02/20/2018
|
Application #:
|
15002404
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Filing Dt:
|
01/21/2016
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Publication #:
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|
Pub Dt:
|
07/27/2017
| | | | |
Title:
|
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/29/2017
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Application #:
|
15002405
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Filing Dt:
|
01/21/2016
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Publication #:
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|
Pub Dt:
|
07/27/2017
| | | | |
Title:
|
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
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|
|
Patent #:
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NONE
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Issue Dt:
|
|
Application #:
|
15003765
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Filing Dt:
|
01/21/2016
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Publication #:
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|
Pub Dt:
|
07/27/2017
| | | | |
Title:
|
SEMICONDUCTOR STRUCTURE INCLUDING A CAPACITOR STRUCTURE AND FABRICATING METHOD THEREOF
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|
|
Patent #:
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NONE
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Issue Dt:
|
|
Application #:
|
15003812
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Filing Dt:
|
01/22/2016
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Publication #:
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|
Pub Dt:
|
07/27/2017
| | | | |
Title:
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METHOD FOR MANUFACTURING A PACKAGE-ON-PACKAGE ASSEMBLY
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|
|
Patent #:
|
|
Issue Dt:
|
04/11/2017
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Application #:
|
15005794
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Filing Dt:
|
01/25/2016
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Publication #:
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|
Pub Dt:
|
08/04/2016
| | | | |
Title:
|
SOLID STATE LIGHTING DEVICES WITH REDUCED CRYSTAL LATTICE DISLOCATIONS AND ASSOCIATED METHODS OF MANUFACTURING
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|
|
Patent #:
|
|
Issue Dt:
|
03/06/2018
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Application #:
|
15006134
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Filing Dt:
|
01/26/2016
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Publication #:
|
|
Pub Dt:
|
07/27/2017
| | | | |
Title:
|
METHOD OF FORMING PATTERNS
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|
|
Patent #:
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NONE
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Issue Dt:
|
|
Application #:
|
15013995
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Filing Dt:
|
02/02/2016
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Publication #:
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Pub Dt:
|
08/03/2017
| | | | |
Title:
|
THREE-WAY VALVE AND METHOD FOR USING THE SAME
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|
|
Patent #:
|
|
Issue Dt:
|
02/21/2017
|
Application #:
|
15047632
|
Filing Dt:
|
02/19/2016
|
Title:
|
METHOD FOR FABRICATING WAFER LEVEL PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/04/2017
|
Application #:
|
15060577
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Filing Dt:
|
03/03/2016
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Title:
|
SEMICONDUCTOR PACKAGE WITH DOUBLE SIDE MOLDING
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|
|
Patent #:
|
|
Issue Dt:
|
09/11/2018
|
Application #:
|
15060609
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Filing Dt:
|
03/04/2016
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Publication #:
|
|
Pub Dt:
|
09/07/2017
| | | | |
Title:
|
METHOD OF FORMING PATTERNS
|
|
|
Patent #:
|
|
Issue Dt:
|
02/14/2017
|
Application #:
|
15068649
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Filing Dt:
|
03/14/2016
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Title:
|
SEMICONDUCTOR PACKAGE WITH SIDEWALL-PROTECTED RDL INTERPOSER AND FABRICATION METHOD THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
07/11/2017
|
Application #:
|
15069911
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Filing Dt:
|
03/14/2016
|
Title:
|
METHOD OF FABRICATING A WAFER LEVEL PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/04/2017
|
Application #:
|
15069936
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Filing Dt:
|
03/14/2016
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Title:
|
METHOD OF FORMING PATTERNS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/05/2018
|
Application #:
|
15077334
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Filing Dt:
|
03/22/2016
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Publication #:
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Pub Dt:
|
07/14/2016
| | | | |
Title:
|
METHODS OF PROVIDING ACCESS TO I/O DEVICES
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|
|
Patent #:
|
|
Issue Dt:
|
08/01/2017
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Application #:
|
15098341
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Filing Dt:
|
04/14/2016
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Title:
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SEMICONDUCTOR PACKAGE WITH MULTIPLE COPLANAR INTERPOSERS
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Patent #:
|
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Issue Dt:
|
09/06/2016
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Application #:
|
15134396
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Filing Dt:
|
04/21/2016
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Title:
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PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
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|
|
Patent #:
|
|
Issue Dt:
|
09/12/2017
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Application #:
|
15135539
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Filing Dt:
|
04/21/2016
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Title:
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SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
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|
|
Patent #:
|
|
Issue Dt:
|
02/28/2017
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Application #:
|
15137596
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Filing Dt:
|
04/25/2016
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Publication #:
|
|
Pub Dt:
|
10/27/2016
| | | | |
Title:
|
MULTI-JUNCTION SOLID STATE TRANSDUCER DEVICES FOR DIRECT AC POWER AND ASSOCIATED SYSTEMS AND METHODS
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|
|
Patent #:
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|
Issue Dt:
|
01/30/2018
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Application #:
|
15151503
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Filing Dt:
|
05/11/2016
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Publication #:
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|
Pub Dt:
|
11/16/2017
| | | | |
Title:
|
SEMICONDUCTOR MEMORY DEVICE HAVING COPLANAR DIGIT LINE CONTACTS AND STORAGE NODE CONTACTS IN MEMORY ARRAY AND METHOD FOR FABRICATING THE SAME
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|
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Patent #:
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|
Issue Dt:
|
10/10/2017
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Application #:
|
15155090
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Filing Dt:
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05/16/2016
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Title:
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METHOD FOR FORMING A PATTERNED LAYER
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Patent #:
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Issue Dt:
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08/15/2017
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Application #:
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15219265
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Filing Dt:
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07/25/2016
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Title:
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CONDUCTIVE PADS FORMING METHOD
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Patent #:
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Issue Dt:
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10/10/2017
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Application #:
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15242594
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Filing Dt:
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08/21/2016
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Title:
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SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
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Patent #:
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Issue Dt:
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01/02/2018
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Application #:
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15253894
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Filing Dt:
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09/01/2016
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Publication #:
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Pub Dt:
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07/27/2017
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Title:
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METHOD OF FABRICATING SEMICONDUCTOR MEMORY DEVICE HAVING ENLARGED CELL CONTACT AREA
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Patent #:
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Issue Dt:
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05/29/2018
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Application #:
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15262956
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Filing Dt:
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09/12/2016
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Publication #:
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Pub Dt:
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12/29/2016
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Title:
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SOLID STATE LIGHTING DEVICES WITH ACCESSIBLE ELECTRODES AND METHODS OF MANUFACTURING
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Patent #:
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Issue Dt:
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11/10/2020
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Application #:
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15286582
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Filing Dt:
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10/06/2016
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Publication #:
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Pub Dt:
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04/12/2018
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Title:
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MICROELECTRONIC PACKAGE UTILIZING EMBEDDED BRIDGE THROUGH-SILICON-VIA INTERCONNECT COMPONENT AND RELATED METHODS
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Patent #:
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Issue Dt:
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12/22/2020
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Application #:
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15291086
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Filing Dt:
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10/12/2016
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Publication #:
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Pub Dt:
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04/12/2018
| | | | |
Title:
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WAFER LEVEL PACKAGE UTILIZING MOLDED INTERPOSER
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15296053
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Filing Dt:
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10/18/2016
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Publication #:
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Pub Dt:
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04/19/2018
| | | | |
Title:
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SYSTEM AND METHOD FOR DETECTING FAULT EVENTS
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Patent #:
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Issue Dt:
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10/10/2017
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Application #:
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15296058
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Filing Dt:
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10/18/2016
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Publication #:
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Pub Dt:
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09/14/2017
| | | | |
Title:
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SEMICONDUCTOR PACKAGE WITH SIDEWALL-PROTECTED RDL INTERPOSER
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Patent #:
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Issue Dt:
|
11/19/2019
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Application #:
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15298131
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Filing Dt:
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10/19/2016
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Publication #:
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Pub Dt:
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02/09/2017
| | | | |
Title:
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SOLID STATE OPTOELECTRONIC DEVICE WITH PLATED SUPPORT SUBSTRATE
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Patent #:
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Issue Dt:
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06/26/2018
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Application #:
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15298156
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Filing Dt:
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10/19/2016
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Publication #:
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Pub Dt:
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04/19/2018
| | | | |
Title:
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STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS AND MOLDED UNDERFILL
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Patent #:
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Issue Dt:
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10/15/2019
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Application #:
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15312010
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Filing Dt:
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11/17/2016
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Publication #:
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Pub Dt:
|
08/09/2018
| | | | |
Title:
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VOLTAGE GENERATION CIRCUIT
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Patent #:
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Issue Dt:
|
01/23/2018
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Application #:
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15333507
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Filing Dt:
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10/25/2016
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Publication #:
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Pub Dt:
|
02/09/2017
| | | | |
Title:
|
OUTPUT BUFFER CIRCUIT WITH LOW SUB-THRESHOLD LEAKAGE CURRENT
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Patent #:
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Issue Dt:
|
08/06/2019
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Application #:
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15333774
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Filing Dt:
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10/25/2016
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Publication #:
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Pub Dt:
|
02/09/2017
| | | | |
Title:
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MEMORY CELLS INCLUDING A METAL CHALCOGENIDE MATERIAL AND RELATED METHODS
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Patent #:
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Issue Dt:
|
05/22/2018
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Application #:
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15334069
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Filing Dt:
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10/25/2016
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Publication #:
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Pub Dt:
|
02/09/2017
| | | | |
Title:
|
METHOD OF ASSEMBLY SEMICONDUCTOR DEVICE WITH THROUGH-PACKAGE INTERCONNECT
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Patent #:
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Issue Dt:
|
08/20/2019
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Application #:
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15334186
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Filing Dt:
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10/25/2016
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Publication #:
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Pub Dt:
|
02/09/2017
| | | | |
Title:
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Memory Cells and Methods of Forming Memory Cells
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Patent #:
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Issue Dt:
|
05/30/2017
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Application #:
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15335259
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Filing Dt:
|
10/26/2016
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Title:
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Methods of Forming Integrated Circuitry
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|
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Patent #:
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|
Issue Dt:
|
08/14/2018
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Application #:
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15336071
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Filing Dt:
|
10/27/2016
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Publication #:
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|
Pub Dt:
|
05/03/2018
| | | | |
Title:
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APPARATUSES AND METHODS FOR SINGLE LEVEL CELL CACHING
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|
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Patent #:
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Issue Dt:
|
12/18/2018
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Application #:
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15338154
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Filing Dt:
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10/28/2016
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Publication #:
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Pub Dt:
|
05/03/2018
| | | | |
Title:
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APPARATUSES INCLUDING MEMORY CELLS AND METHODS OF OPERATION OF SAME
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|
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Patent #:
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|
Issue Dt:
|
10/22/2019
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Application #:
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15339290
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Filing Dt:
|
10/31/2016
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Publication #:
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|
Pub Dt:
|
02/16/2017
| | | | |
Title:
|
METHOD FOR PACKAGING CIRCUITS
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|
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Patent #:
|
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Issue Dt:
|
06/12/2018
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Application #:
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15339374
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Filing Dt:
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10/31/2016
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Publication #:
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Pub Dt:
|
02/16/2017
| | | | |
Title:
|
MEMORY DEVICES HAVING SOURCE LINES DIRECTLY COUPLED TO BODY REGIONS AND METHODS
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|
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Patent #:
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|
Issue Dt:
|
09/24/2019
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Application #:
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15339693
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Filing Dt:
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10/31/2016
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Publication #:
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Pub Dt:
|
05/03/2018
| | | | |
Title:
|
SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIATED SYSTEMS AND METHODS
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|
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Patent #:
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|
Issue Dt:
|
05/14/2019
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Application #:
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15339699
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Filing Dt:
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10/31/2016
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Publication #:
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Pub Dt:
|
02/16/2017
| | | | |
Title:
|
Methods of Forming and Using Fuses
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|
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Patent #:
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|
Issue Dt:
|
12/25/2018
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Application #:
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15340682
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Filing Dt:
|
11/01/2016
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Publication #:
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Pub Dt:
|
05/03/2018
| | | | |
Title:
|
CELL DISTURB PREVENTION USING A LEAKER DEVICE TO REDUCE EXCESS
CHARGE FROM AN ELECTRONIC DEVICE
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|
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Patent #:
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Issue Dt:
|
07/03/2018
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Application #:
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15340838
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Filing Dt:
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11/01/2016
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Publication #:
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|
Pub Dt:
|
05/03/2018
| | | | |
Title:
|
Methods of Forming an Array Comprising Pairs of Vertically Opposed Capacitors and Arrays Comprising Pairs of Vertically Opposed Capacitors
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|
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Patent #:
|
|
Issue Dt:
|
09/12/2017
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Application #:
|
15340842
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Filing Dt:
|
11/01/2016
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Title:
|
METHODS OF FORMING AN ARRAY COMPRISING PAIRS OF VERTICALLY OPPOSED CAPACITORS AND ARRAYS COMPRISING PAIRS OF VERTICALLY OPPOSED CAPACITORS
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|
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Patent #:
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|
Issue Dt:
|
10/23/2018
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Application #:
|
15341410
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Filing Dt:
|
11/02/2016
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Publication #:
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|
Pub Dt:
|
02/23/2017
| | | | |
Title:
|
PROGRAM AND READ TRIM SETTING
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|
|
Patent #:
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|
Issue Dt:
|
03/20/2018
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Application #:
|
15342124
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Filing Dt:
|
11/03/2016
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Title:
|
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
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|
|
Patent #:
|
|
Issue Dt:
|
01/23/2018
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Application #:
|
15342255
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Filing Dt:
|
11/03/2016
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Publication #:
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|
Pub Dt:
|
03/16/2017
| | | | |
Title:
|
ACCESS LINE MANAGEMENT IN A MEMORY DEVICE
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|
|
Patent #:
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|
Issue Dt:
|
11/13/2018
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Application #:
|
15342287
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Filing Dt:
|
11/03/2016
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Publication #:
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Pub Dt:
|
03/16/2017
| | | | |
Title:
|
SENSE OPERATION FLAGS IN A MEMORY DEVICE
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|
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Patent #:
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|
Issue Dt:
|
07/10/2018
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Application #:
|
15344211
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Filing Dt:
|
11/04/2016
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Publication #:
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Pub Dt:
|
05/10/2018
| | | | |
Title:
|
WIRING WITH EXTERNAL TERMINAL
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|
Patent #:
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|
Issue Dt:
|
12/25/2018
|
Application #:
|
15344893
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Filing Dt:
|
11/07/2016
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Publication #:
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Pub Dt:
|
02/23/2017
| | | | |
Title:
|
BONDING PADS WITH THERMAL PATHWAYS
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|
|
Patent #:
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Issue Dt:
|
04/10/2018
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Application #:
|
15345636
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Filing Dt:
|
11/08/2016
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Publication #:
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Pub Dt:
|
03/16/2017
| | | | |
Title:
|
MAGNETIC TUNNEL JUNCTIONS, METHODS USED WHILE FORMING MAGNETIC TUNNEL JUNCTIONS, AND METHODS OF FORMING MAGNETIC TUNNEL JUNCTIONS
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Patent #:
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Issue Dt:
|
10/01/2019
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Application #:
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15345783
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Filing Dt:
|
11/08/2016
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Publication #:
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Pub Dt:
|
05/10/2018
| | | | |
Title:
|
MEMORY OPERATIONS ON DATA
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Patent #:
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Issue Dt:
|
04/16/2019
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Application #:
|
15345862
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Filing Dt:
|
11/08/2016
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Publication #:
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Pub Dt:
|
05/10/2018
| | | | |
Title:
|
MEMORY MANAGEMENT
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|
|
Patent #:
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Issue Dt:
|
05/12/2020
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Application #:
|
15345919
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Filing Dt:
|
11/08/2016
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Publication #:
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Pub Dt:
|
05/10/2018
| | | | |
Title:
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DATA RELOCATION IN HYBRID MEMORY
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Patent #:
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Issue Dt:
|
11/26/2019
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Application #:
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15346526
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Filing Dt:
|
11/08/2016
|
Publication #:
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Pub Dt:
|
02/23/2017
| | | | |
Title:
|
COMPARISON OPERATIONS IN MEMORY
|
|