Patent Assignment Details
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| Reel/Frame: | 049978/0106 | |
| Pages: | 6 |
| | Recorded: | 08/06/2019 | | |
| Attorney Dkt #: | 045288.000051 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/27/2021
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Application #:
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16532843
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Filing Dt:
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08/06/2019
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Publication #:
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Pub Dt:
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02/06/2020
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Title:
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SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD, SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING METHOD, METHOD OF REMOVING LIQUID FROM UPPER SUFACE OF WAFER TO BE POLISHED, ELASTIC FILM FOR PRESSING WAFER AGAINST POLISHING PAD, SUBSTRATE RELEASE METHOD, AND CONSTANT AMOUNT GAS SUPPLY APPARATUS
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Assignee
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| 11-1, HANEDA ASAHI-CHO, OTA-KU |
| TOKYO, JAPAN 1448510 |
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Correspondence name and address
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BAKER & HOSTETLER LLP
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999 THIRD AVENUE
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SUITE 3600
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SEATTLE, WA 98104-4040
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