Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 047245/0107 | |
| Pages: | 6 |
| | Recorded: | 10/17/2018 | | |
| Attorney Dkt #: | 61879US01; 61879US02 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/22/2023
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Application #:
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16022345
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Filing Dt:
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06/28/2018
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Publication #:
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Pub Dt:
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05/09/2019
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Title:
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HIGH RELIABILITY LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS IN EXTREME ENVIRONMENTS
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Assignee
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| 155 HARLEM AVENUE |
| GLENVIEW, ILLINOIS 60025 |
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Correspondence name and address
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MCANDREWS, HELD & MALLOY, LTD.
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500 W. MADISON ST.
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34TH FLOOR
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CHICAGO, IL 60661
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