Patent Assignment Details
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Reel/Frame: | 016095/0110 | |
| Pages: | 4 |
| | Recorded: | 12/28/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10967017
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Filing Dt:
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10/14/2004
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Publication #:
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Pub Dt:
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04/20/2006
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Title:
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DESOLDERING WICK FOR LEAD-FREE SOLDER
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Assignee
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4-5, SHIOKUSA, 2-CHOME, NANIWA-KU |
OSAKA, JAPAN |
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Correspondence name and address
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SQUIRE, SANDERS & DEMPSEY, LLP
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DOUGLAS N. LARSON , ESQ.
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801 S. FIGUEROA STREET, 14TH FLOOR
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LOS ANGELES, CA 90017-5554
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