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Reel/Frame:028189/0111   Pages: 3
Recorded: 05/10/2012
Attorney Dkt #:36398-00002
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/20/2005
Application #:
11091965
Filing Dt:
03/28/2005
Publication #:
Pub Dt:
09/01/2005
Title:
POLISHING PAD FOR USE IN CHEMICAL/MECHANICAL PLANARIZATION OF SEMICONDUCTOR WAFERS HAVING A TRANSPARENT WINDOW FOR END-POINT DETERMINATION AND METHOD OF MAKING
Assignors
1
Exec Dt:
04/23/2003
2
Exec Dt:
04/23/2003
3
Exec Dt:
04/23/2003
4
Exec Dt:
04/23/2003
Assignee
1
609 E. CHANEY STREET
SULLIVAN, INDIANA 47882
Correspondence name and address
MCDONALD HOPKINS LLC
600 SUPERIOR AVENUE
SUITE 2100
CLEVELAND, OH 44114

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