Patent Assignment Details
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| Reel/Frame: | 011451/0118 | |
| Pages: | 2 |
| | Recorded: | 01/09/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/22/2003
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Application #:
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09757729
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Filing Dt:
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01/09/2001
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Publication #:
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Pub Dt:
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06/20/2002
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Title:
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MOLDED PLASTIC PACKAGE WITH HEAT SINK AND ENHANCED ELECTRICAL PERFORMANCE
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Assignee
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| QPL INDUSTRIAL BUILDING, 138 TEXACO ROAD |
| TSUEN WAN, NT, HONG KONG |
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Correspondence name and address
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SKJERVEN, MORRILL, MACPHERSON LLP
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EDWARD C. KWOK
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25 METRO DRIVE
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SUITE 700
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SAN JOSE, CA 95110
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