Patent Assignment Details
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Reel/Frame: | 011098/0120 | |
| Pages: | 2 |
| | Recorded: | 09/07/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/20/2002
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Application #:
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09656983
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Filing Dt:
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09/07/2000
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Title:
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THERMALLY ENHANCED CHIP SCALE PACKAGE
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Assignee
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1310 ELECTRONICS DRIVE |
CARROLLTON, TEXAS 75006 |
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Correspondence name and address
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FELSMAN, BRADLEY, VADEN, GUNTER ET AL
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DAN VENGLARIK
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201 MAIN STREET, SUITE 1600
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FORT WORTH, TX 76102
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