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Reel/Frame:	033303/0124			Pages:	80
		Recorded:	07/11/2014
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 414
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Patent #:	NONE	Issue Dt:		Application #:	11840235	Filing Dt:	08/17/2007
Publication #:	US20070281467	Pub Dt:	12/06/2007
Title:	Top layers of metal for high performance IC's

Patent #:	NONE	Issue Dt:		Application #:	11840236	Filing Dt:	08/17/2007
Publication #:	US20070281468	Pub Dt:	12/06/2007
Title:	Top layers of metal for high performance IC's

Patent #:	NONE	Issue Dt:		Application #:	11840237	Filing Dt:	08/17/2007
Publication #:	US20070281463	Pub Dt:	12/06/2007
Title:	Top layers of metal for high performance IC's

Patent #:	NONE	Issue Dt:		Application #:	11840238	Filing Dt:	08/17/2007
Publication #:	US20070278686	Pub Dt:	12/06/2007
Title:	Top layers of metal for high performance IC's

Patent #:	7465975	Issue Dt:	12/16/2008	Application #:	11840239	Filing Dt:	08/17/2007
Publication #:	US20070278687	Pub Dt:	12/06/2007
Title:	TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S

Patent #:	NONE	Issue Dt:		Application #:	11840241	Filing Dt:	08/17/2007
Publication #:	US20070281458	Pub Dt:	12/06/2007
Title:	Top layers of metal for high performance IC's

Patent #:	7425764	Issue Dt:	09/16/2008	Application #:	11840242	Filing Dt:	08/17/2007
Publication #:	US20070278679	Pub Dt:	12/06/2007
Title:	TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S

Patent #:	NONE	Issue Dt:		Application #:	11840243	Filing Dt:	08/17/2007
Publication #:	US20070278691	Pub Dt:	12/06/2007
Title:	Top layers of metal for high performance IC's

Patent #:	8471384	Issue Dt:	06/25/2013	Application #:	11842153	Filing Dt:	08/21/2007
Publication #:	US20070284750	Pub Dt:	12/13/2007
Title:	TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S

Patent #:	NONE	Issue Dt:		Application #:	11842158	Filing Dt:	08/21/2007
Publication #:	US20070284751	Pub Dt:	12/13/2007
Title:	Top layers of metal for high performance IC's

Patent #:	NONE	Issue Dt:		Application #:	11842159	Filing Dt:	08/21/2007
Publication #:	US20070284753	Pub Dt:	12/13/2007
Title:	Top layers of metal for high performance IC's

Patent #:	7482693	Issue Dt:	01/27/2009	Application #:	11842160	Filing Dt:	08/21/2007
Publication #:	US20070284739	Pub Dt:	12/13/2007
Title:	TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S

Patent #:	NONE	Issue Dt:		Application #:	11842161	Filing Dt:	08/21/2007
Publication #:	US20070284752	Pub Dt:	12/13/2007
Title:	Top layers of metal for high performance IC's

Patent #:	7960212	Issue Dt:	06/14/2011	Application #:	11842957	Filing Dt:	08/22/2007
Publication #:	US20080070345	Pub Dt:	03/20/2008
Title:	STRUCTURE OF HIGH PERFORMANCE COMBO CHIP AND PROCESSING METHOD

Patent #:	8124446	Issue Dt:	02/28/2012	Application #:	11842958	Filing Dt:	08/22/2007
Publication #:	US20080070346	Pub Dt:	03/20/2008
Title:	STRUCTURE OF HIGH PERFORMANCE COMBO CHIP AND PROCESSING METHOD

Patent #:	NONE	Issue Dt:		Application #:	11845109	Filing Dt:	08/27/2007
Publication #:	US20070290348	Pub Dt:	12/20/2007
Title:	TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S

Patent #:	NONE	Issue Dt:		Application #:	11845110	Filing Dt:	08/27/2007
Publication #:	US20070290349	Pub Dt:	12/20/2007
Title:	Top layers of metal for high performance IC's

Patent #:	NONE	Issue Dt:		Application #:	11845111	Filing Dt:	08/27/2007
Publication #:	US20070290350	Pub Dt:	12/20/2007
Title:	Top layers of metal for high performance IC's

Patent #:	NONE	Issue Dt:		Application #:	11845113	Filing Dt:	08/27/2007
Publication #:	US20070290351	Pub Dt:	12/20/2007
Title:	TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S

Patent #:	7385292	Issue Dt:	06/10/2008	Application #:	11845115	Filing Dt:	08/27/2007
Publication #:	US20070290352	Pub Dt:	12/20/2007
Title:	TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S

Patent #:	7388292	Issue Dt:	06/17/2008	Application #:	11845116	Filing Dt:	08/27/2007
Publication #:	US20070290353	Pub Dt:	12/20/2007
Title:	TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S

Patent #:	NONE	Issue Dt:		Application #:	11845122	Filing Dt:	08/27/2007
Publication #:	US20070290354	Pub Dt:	12/20/2007
Title:	Top layers of metal for high performance IC's

Patent #:	8415800	Issue Dt:	04/09/2013	Application #:	11845123	Filing Dt:	08/27/2007
Publication #:	US20070290368	Pub Dt:	12/20/2007
Title:	TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S

Patent #:	NONE	Issue Dt:		Application #:	11845759	Filing Dt:	08/27/2007
Publication #:	US20070290355	Pub Dt:	12/20/2007
Title:	Top layers of metal for high performance IC's

Patent #:	NONE	Issue Dt:		Application #:	11845764	Filing Dt:	08/27/2007
Publication #:	US20070290356	Pub Dt:	12/20/2007
Title:	Top layers of metal for high performance IC's

Patent #:	7382058	Issue Dt:	06/03/2008	Application #:	11845766	Filing Dt:	08/27/2007
Publication #:	US20070290357	Pub Dt:	12/20/2007
Title:	TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S

Patent #:	NONE	Issue Dt:		Application #:	11845771	Filing Dt:	08/27/2007
Publication #:	US20070290358	Pub Dt:	12/20/2007
Title:	Top layers of metal for high performance IC's

Patent #:	NONE	Issue Dt:		Application #:	11845773	Filing Dt:	08/27/2007
Publication #:	US20070293036	Pub Dt:	12/20/2007
Title:	Top layers of metal for high performance IC's

Patent #:	7396756	Issue Dt:	07/08/2008	Application #:	11845775	Filing Dt:	08/27/2007
Publication #:	US20070293037	Pub Dt:	12/20/2007
Title:	TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S

Patent #:	7960825	Issue Dt:	06/14/2011	Application #:	11850674	Filing Dt:	09/05/2007
Publication #:	US20080054441	Pub Dt:	03/06/2008
Title:	CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME

Patent #:	7582966	Issue Dt:	09/01/2009	Application #:	11850677	Filing Dt:	09/06/2007
Publication #:	US20080054457	Pub Dt:	03/06/2008
Title:	SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME

Patent #:	8004088	Issue Dt:	08/23/2011	Application #:	11854552	Filing Dt:	09/13/2007
Publication #:	US20080001300	Pub Dt:	01/03/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF IC CHIP

Patent #:	7462938	Issue Dt:	12/09/2008	Application #:	11854555	Filing Dt:	09/13/2007
Publication #:	US20080001301	Pub Dt:	01/03/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF IC CHIP

Patent #:	NONE	Issue Dt:		Application #:	11854556	Filing Dt:	09/13/2007
Publication #:	US20080067693	Pub Dt:	03/20/2008
Title:	Post passivation interconnection schemes on top of IC chip

Patent #:	NONE	Issue Dt:		Application #:	11854559	Filing Dt:	09/13/2007
Publication #:	US20080067694	Pub Dt:	03/20/2008
Title:	Post passivation interconnection schemes on top of IC chip

Patent #:	7919865	Issue Dt:	04/05/2011	Application #:	11854561	Filing Dt:	09/13/2007
Publication #:	US20080061444	Pub Dt:	03/13/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF IC CHIP

Patent #:	8461686	Issue Dt:	06/11/2013	Application #:	11854562	Filing Dt:	09/13/2007
Publication #:	US20080067686	Pub Dt:	03/20/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF IC CHIP

Patent #:	7382052	Issue Dt:	06/03/2008	Application #:	11856072	Filing Dt:	09/17/2007
Publication #:	US20080001293	Pub Dt:	01/03/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF IC CHIP

Patent #:	8482127	Issue Dt:	07/09/2013	Application #:	11856073	Filing Dt:	09/17/2007
Publication #:	US20080042285	Pub Dt:	02/21/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF IC CHIP

Patent #:	8492900	Issue Dt:	07/23/2013	Application #:	11856074	Filing Dt:	09/17/2007
Publication #:	US20080042293	Pub Dt:	02/21/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF IC CHIP

Patent #:	7439626	Issue Dt:	10/21/2008	Application #:	11856075	Filing Dt:	09/17/2007
Publication #:	US20080001294	Pub Dt:	01/03/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF IC CHIP

Patent #:	8188603	Issue Dt:	05/29/2012	Application #:	11856076	Filing Dt:	09/17/2007
Publication #:	US20080042294	Pub Dt:	02/21/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF IC CHIP

Patent #:	7459791	Issue Dt:	12/02/2008	Application #:	11856077	Filing Dt:	09/17/2007
Publication #:	US20080042295	Pub Dt:	02/21/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF IC CHIP

Patent #:	7466007	Issue Dt:	12/16/2008	Application #:	11856078	Filing Dt:	09/17/2007
Publication #:	US20080001302	Pub Dt:	01/03/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF IC CHIP

Patent #:	7915161	Issue Dt:	03/29/2011	Application #:	11856080	Filing Dt:	09/17/2007
Publication #:	US20080045008	Pub Dt:	02/21/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF IC CHIP

Patent #:	7446035	Issue Dt:	11/04/2008	Application #:	11856081	Filing Dt:	09/17/2007
Publication #:	US20080045004	Pub Dt:	02/21/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF IC CHIPS

Patent #:	7892965	Issue Dt:	02/22/2011	Application #:	11856082	Filing Dt:	09/17/2007
Publication #:	US20080003806	Pub Dt:	01/03/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF IC CHIP

Patent #:	7524759	Issue Dt:	04/28/2009	Application #:	11856083	Filing Dt:	09/17/2007
Publication #:	US20080057703	Pub Dt:	03/06/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF IC CHIP

Patent #:	7923366	Issue Dt:	04/12/2011	Application #:	11856087	Filing Dt:	09/17/2007
Publication #:	US20080045001	Pub Dt:	02/21/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF IC CHIP

Patent #:	8435883	Issue Dt:	05/07/2013	Application #:	11856088	Filing Dt:	09/17/2007
Publication #:	US20080045002	Pub Dt:	02/21/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF IC CHIPS

Patent #:	7419900	Issue Dt:	09/02/2008	Application #:	11858904	Filing Dt:	09/21/2007
Publication #:	US20080003807	Pub Dt:	01/03/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF THE IC CHIPS

Patent #:	7443034	Issue Dt:	10/28/2008	Application #:	11858905	Filing Dt:	09/21/2007
Publication #:	US20080042296	Pub Dt:	02/21/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF THE IC CHIPS

Patent #:	7425767	Issue Dt:	09/16/2008	Application #:	11861290	Filing Dt:	09/26/2007
Publication #:	US20080012132	Pub Dt:	01/17/2008
Title:	CHIP STRUCTURE WITH REDISTRIBUTION TRACES

Patent #:	7439627	Issue Dt:	10/21/2008	Application #:	11861295	Filing Dt:	09/26/2007
Publication #:	US20080006946	Pub Dt:	01/10/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF THE IC CHIPS

Patent #:	7479450	Issue Dt:	01/20/2009	Application #:	11861299	Filing Dt:	09/26/2007
Publication #:	US20080009131	Pub Dt:	01/10/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF THE IC CHIPS

Patent #:	7969006	Issue Dt:	06/28/2011	Application #:	11864917	Filing Dt:	09/29/2007
Publication #:	US20080080111	Pub Dt:	04/03/2008
Title:	INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

Patent #:	NONE	Issue Dt:		Application #:	11864926	Filing Dt:	09/29/2007
Publication #:	US20080079461	Pub Dt:	04/03/2008
Title:	INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

Patent #:	8004083	Issue Dt:	08/23/2011	Application #:	11864927	Filing Dt:	09/29/2007
Publication #:	US20080080112	Pub Dt:	04/03/2008
Title:	INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

Patent #:	8373202	Issue Dt:	02/12/2013	Application #:	11864931	Filing Dt:	09/29/2007
Publication #:	US20080111242	Pub Dt:	05/15/2008
Title:	INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

Patent #:	8021918	Issue Dt:	09/20/2011	Application #:	11864935	Filing Dt:	09/29/2007
Publication #:	US20080081458	Pub Dt:	04/03/2008
Title:	INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

Patent #:	7989954	Issue Dt:	08/02/2011	Application #:	11864938	Filing Dt:	09/29/2007
Publication #:	US20080080113	Pub Dt:	04/03/2008
Title:	INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

Patent #:	NONE	Issue Dt:		Application #:	11865059	Filing Dt:	09/30/2007
Publication #:	US20080081457	Pub Dt:	04/03/2008
Title:	INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

Patent #:	NONE	Issue Dt:		Application #:	11874906	Filing Dt:	10/19/2007
Publication #:	US20080035974	Pub Dt:	02/14/2008
Title:	integrated circuit chip with discrete component over passivation layer

Patent #:	NONE	Issue Dt:		Application #:	11874909	Filing Dt:	10/19/2007
Publication #:	US20080035972	Pub Dt:	02/14/2008
Title:	High performance system-on-chip using post passivation process

Patent #:	NONE	Issue Dt:		Application #:	11874910	Filing Dt:	10/19/2007
Publication #:	US20080038869	Pub Dt:	02/14/2008
Title:	High performance system-on-chip using post passivation process

Patent #:	NONE	Issue Dt:		Application #:	11877641	Filing Dt:	10/23/2007
Publication #:	US20080042238	Pub Dt:	02/21/2008
Title:	HIGH PERFORMANCE SYSTEM-ON-CHIP USING POST PASSIVATION PROCESS

Patent #:	7422941	Issue Dt:	09/09/2008	Application #:	11877647	Filing Dt:	10/23/2007
Publication #:	US20080044976	Pub Dt:	02/21/2008
Title:	HIGH PERFORMANCE SYSTEM-ON-CHIP USING POST PASSIVATION PROCESS

Patent #:	8487400	Issue Dt:	07/16/2013	Application #:	11877649	Filing Dt:	10/23/2007
Publication #:	US20080042239	Pub Dt:	02/21/2008
Title:	HIGH PERFORMANCE SYSTEM-ON-CHIP USING POST PASSIVATION PROCESS

Patent #:	NONE	Issue Dt:		Application #:	11877651	Filing Dt:	10/23/2007
Publication #:	US20080042273	Pub Dt:	02/21/2008
Title:	High performance system-on-chip using post passivation process

Patent #:	NONE	Issue Dt:		Application #:	11877652	Filing Dt:	10/23/2007
Publication #:	US20080044977	Pub Dt:	02/21/2008
Title:	High performance system-on-chip using post passivation process

Patent #:	NONE	Issue Dt:		Application #:	11877654	Filing Dt:	10/23/2007
Publication #:	US20080042289	Pub Dt:	02/21/2008
Title:	HIGH PERFORMANCE SYSTEM-ON-CHIP USING POST PASSIVATION PROCESS

Patent #:	7482268	Issue Dt:	01/27/2009	Application #:	11877657	Filing Dt:	10/23/2007
Publication #:	US20080045007	Pub Dt:	02/21/2008
Title:	TOP LAYERS OF METAL FOR INTEGRATED CIRCUITS

Patent #:	7521805	Issue Dt:	04/21/2009	Application #:	11877658	Filing Dt:	10/23/2007
Publication #:	US20080042297	Pub Dt:	02/21/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF THE IC CHIPS

Patent #:	NONE	Issue Dt:		Application #:	11893659	Filing Dt:	08/17/2007
Publication #:	US20070288880	Pub Dt:	12/13/2007
Title:	Top layers of metal for high performance IC's

Patent #:	7517778	Issue Dt:	04/14/2009	Application #:	11901079	Filing Dt:	09/14/2007
Publication #:	US20080009098	Pub Dt:	01/10/2008
Title:	STRUCTURE OF HIGH PERFORMANCE COMBO CHIP AND PROCESSING METHOD

Patent #:	7449752	Issue Dt:	11/11/2008	Application #:	11906833	Filing Dt:	10/04/2007
Publication #:	US20080029785	Pub Dt:	02/07/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF THE IC CHIPS

Patent #:	7902067	Issue Dt:	03/08/2011	Application #:	11906840	Filing Dt:	10/04/2007
Publication #:	US20080032496	Pub Dt:	02/07/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF THE IC CHIPS

Patent #:	8138079	Issue Dt:	03/20/2012	Application #:	11926154	Filing Dt:	10/29/2007
Publication #:	US20080233733	Pub Dt:	09/25/2008
Title:	METHOD OF WIRE BONDING OVER ACTIVE AREA OF A SEMICONDUCTOR CIRCUIT

Patent #:	9142527	Issue Dt:	09/22/2015	Application #:	11926156	Filing Dt:	10/29/2007
Publication #:	US20080045003	Pub Dt:	02/21/2008
Title:	METHOD OF WIRE BONDING OVER ACTIVE AREA OF A SEMICONDUCTOR CIRCUIT

Patent #:	7446031	Issue Dt:	11/04/2008	Application #:	11927719	Filing Dt:	10/30/2007
Publication #:	US20080085596	Pub Dt:	04/10/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF IC CHIPS

Patent #:	7534718	Issue Dt:	05/19/2009	Application #:	11927721	Filing Dt:	10/30/2007
Publication #:	US20080085597	Pub Dt:	04/10/2008
Title:	POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF IC CHIPS

Patent #:	NONE	Issue Dt:		Application #:	11930149	Filing Dt:	10/31/2007
Publication #:	US20080083985	Pub Dt:	04/10/2008
Title:	Low fabrication cost, fine pitch and high reliability solder bump

Patent #:	NONE	Issue Dt:		Application #:	11930156	Filing Dt:	10/31/2007
Publication #:	US20080054459	Pub Dt:	03/06/2008
Title:	Low fabrication cost, fine pitch and high reliability solder bump

Patent #:	7468316	Issue Dt:	12/23/2008	Application #:	11930163	Filing Dt:	10/31/2007
Publication #:	US20080050906	Pub Dt:	02/28/2008
Title:	LOW FABRICATION COST, FINE PITCH AND HIGH RELIABILITY SOLDER BUMP

Patent #:	7932603	Issue Dt:	04/26/2011	Application #:	11930181	Filing Dt:	10/31/2007
Publication #:	US20080048328	Pub Dt:	02/28/2008
Title:	CHIP STRUCTURE AND PROCESS FOR FORMING THE SAME

Patent #:	7906422	Issue Dt:	03/15/2011	Application #:	11930182	Filing Dt:	10/31/2007
Publication #:	US20080050912	Pub Dt:	02/28/2008
Title:	CHIP STRUCTURE AND PROCESS FOR FORMING THE SAME

Patent #:	NONE	Issue Dt:		Application #:	11930185	Filing Dt:	10/31/2007
Publication #:	US20080083987	Pub Dt:	04/10/2008
Title:	Top layers of metal for high performance IC's

Patent #:	NONE	Issue Dt:		Application #:	11930187	Filing Dt:	10/31/2007
Publication #:	US20080048329	Pub Dt:	02/28/2008
Title:	Top layers of metal for high performance IC's

Patent #:	NONE	Issue Dt:		Application #:	11930189	Filing Dt:	10/31/2007
Publication #:	US20080083988	Pub Dt:	04/10/2008
Title:	Top layers of metal for high performance IC's

Patent #:	7456100	Issue Dt:	11/25/2008	Application #:	11930191	Filing Dt:	10/31/2007
Publication #:	US20080050913	Pub Dt:	02/28/2008
Title:	TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S

Patent #:	8178967	Issue Dt:	05/15/2012	Application #:	11930210	Filing Dt:	10/31/2007
Publication #:	US20100038803	Pub Dt:	02/18/2010
Title:	LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE

Patent #:	9369175	Issue Dt:	06/14/2016	Application #:	11930213	Filing Dt:	10/31/2007
Publication #:	US20080111236	Pub Dt:	05/15/2008
Title:	LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE

Patent #:	8481418	Issue Dt:	07/09/2013	Application #:	11930220	Filing Dt:	10/31/2007
Publication #:	US20090137110	Pub Dt:	05/28/2009
Title:	LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE

Patent #:	NONE	Issue Dt:		Application #:	11930224	Filing Dt:	10/31/2007
Publication #:	US20080113504	Pub Dt:	05/15/2008
Title:	LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE

Patent #:	7973629	Issue Dt:	07/05/2011	Application #:	11930664	Filing Dt:	10/31/2007
Publication #:	US20080054398	Pub Dt:	03/06/2008
Title:	METHOD FOR MAKING HIGH-PERFORMANCE RF INTEGRATED CIRCUITS

Patent #:	7427560	Issue Dt:	09/23/2008	Application #:	11930682	Filing Dt:	10/31/2007
Publication #:	US20080050909	Pub Dt:	02/28/2008
Title:	TOP LAYERS OF METAL FOR HIGH PERFORMANCE IC'S

Patent #:	7863739	Issue Dt:	01/04/2011	Application #:	11930998	Filing Dt:	10/31/2007
Publication #:	US20080048320	Pub Dt:	02/28/2008
Title:	LOW FABRICATION COST, FINE PITCH AND HIGH RELIABILITY SOLDER BUMP

Patent #:	8440272	Issue Dt:	05/14/2013	Application #:	11949785	Filing Dt:	12/04/2007
Publication #:	US20080131983	Pub Dt:	06/05/2008
Title:	METHOD FOR FORMING POST PASSIVATION AU LAYER WITH CLEAN SURFACE

Patent #:	NONE	Issue Dt:		Application #:	11957509	Filing Dt:	12/17/2007
Publication #:	US20080111243	Pub Dt:	05/15/2008
Title:	HIGH PERFORMANCE SYSTEM-ON-CHIP USING POST PASSIVATION PROCESS

100

Patent #:	NONE	Issue Dt:		Application #:	11957510	Filing Dt:	12/17/2007
Publication #:	US20080093745	Pub Dt:	04/24/2008
Title:	High performance system-on-chip using post passivation process

Assignor

MEGIT ACQUISITION CORP.

Exec Dt:

07/09/2014

Assignee

QUALCOMM INCORPORATED

5775 MOREHOUSE DRIVE

SAN DIEGO, CALIFORNIA 92121

Correspondence name and address
	QUALCOMM INCORPORATED
	5775 MOREHOUSE DRIVE
	SAN DIEGO, CA 92121

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