Total properties:
414
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5
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5
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Patent #:
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Issue Dt:
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08/27/2013
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Application #:
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13207346
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Filing Dt:
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08/10/2011
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Publication #:
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Pub Dt:
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12/01/2011
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Title:
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CHIP STRUCTURE
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Patent #:
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Issue Dt:
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04/16/2013
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Application #:
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13207350
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Filing Dt:
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08/10/2011
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Publication #:
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Pub Dt:
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12/01/2011
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Title:
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A CHIP PACKAGE HAVING A CHIP COMBINED WITH A SUBSTRATE VIA A COPPER PILLAR
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Patent #:
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Issue Dt:
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02/05/2013
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Application #:
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13236507
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Filing Dt:
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09/19/2011
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Publication #:
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Pub Dt:
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01/12/2012
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Title:
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CHIP PACKAGE
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Patent #:
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Issue Dt:
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06/03/2014
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Application #:
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13271004
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Filing Dt:
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10/11/2011
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Publication #:
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Pub Dt:
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02/02/2012
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Title:
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SOLDER INTERCONNECT ON IC CHIP
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Patent #:
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Issue Dt:
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02/05/2013
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Application #:
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13277142
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Filing Dt:
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10/19/2011
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Publication #:
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Pub Dt:
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04/26/2012
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Title:
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CHIP STRUCTURE AND PROCESS FOR FORMING THE SAME
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Patent #:
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Issue Dt:
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10/07/2014
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Application #:
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13475820
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Filing Dt:
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05/18/2012
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Publication #:
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Pub Dt:
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09/13/2012
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Title:
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IMAGE AND LIGHT SENSOR CHIP PACKAGES
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13735894
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Filing Dt:
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01/07/2013
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Publication #:
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Pub Dt:
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01/23/2014
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Title:
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HIGH PERFORMANCE IC CHIP HAVING DISCRETE DECOUPLING CAPACITORS ATTACHED TO ITS IC SURFACE
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Patent #:
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Issue Dt:
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12/31/2013
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Application #:
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13735987
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Filing Dt:
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01/07/2013
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Publication #:
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Pub Dt:
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05/23/2013
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Title:
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INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13851050
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Filing Dt:
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03/26/2013
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Publication #:
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Pub Dt:
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08/22/2013
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Title:
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Methods for Fabricating an Integrated Circuit Having a Post-Passivation Thin-Film Resistor
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Patent #:
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Issue Dt:
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12/16/2014
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Application #:
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13853878
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Filing Dt:
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03/29/2013
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Publication #:
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Pub Dt:
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08/29/2013
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Title:
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STRUCTURE AND MANUFACTURING METHOD OF CHIP SCALE PACKAGE
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Patent #:
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Issue Dt:
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04/04/2017
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Application #:
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13874983
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Filing Dt:
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05/01/2013
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Publication #:
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Pub Dt:
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09/19/2013
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Title:
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INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND BOTTOM STRUCTURE TECHNOLOGY
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Patent #:
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Issue Dt:
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09/16/2014
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Application #:
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13887093
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Filing Dt:
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05/03/2013
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Publication #:
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Pub Dt:
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11/21/2013
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Title:
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INTEGRATED CHIP PACKAGE STRUCTURE USING CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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08/12/2014
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Application #:
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13935135
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Filing Dt:
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07/03/2013
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Publication #:
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Pub Dt:
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11/07/2013
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Title:
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SYSTEM-IN PACKAGES
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Patent #:
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Issue Dt:
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08/19/2014
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Application #:
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14034440
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Filing Dt:
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09/23/2013
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Publication #:
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Pub Dt:
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01/23/2014
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Title:
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CHIP PACKAGES HAVING DUAL DMOS DEVICES WITH POWER MANAGEMENT INTEGRATED CIRCUITS
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