Patent Assignment Details
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Reel/Frame: | 034186/0125 | |
| Pages: | 6 |
| | Recorded: | 11/17/2014 | | |
Attorney Dkt #: | 091983-0175 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/28/2017
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Application #:
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14516487
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Filing Dt:
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10/16/2014
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Publication #:
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Pub Dt:
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06/25/2015
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Title:
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HEAT DISSIPATION PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
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Assignees
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12, HEOLLEUNG-RO, SEOCHO-GU |
SEOUL, KOREA, REPUBLIC OF |
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12, HEOLLEUNG-RO, SEOCHO-GU |
SEOUL, KOREA, REPUBLIC OF |
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(SAMPYEONG-DONG), 308, PANGYO-RO |
BUNDANG-GU |
SEONGNAM-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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500 NORTH CAPITOL STREET, NW
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WASHINGTON, DC 20001
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