Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 012006/0126 | |
| Pages: | 2 |
| | Recorded: | 07/25/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
08/20/2002
|
Application #:
|
09740945
|
Filing Dt:
|
12/21/2000
|
Publication #:
|
|
Pub Dt:
|
12/20/2001
| | | | |
Title:
|
METHOD FOR MANUFACTURING A COPPER INTERCONNECTION WITH AN ALUMINUM OXIDE-CONDUCTIVE LAYER STACK BARRIER LAYER IN SEMICONDUCTOR MEMORY DEVICE
|
|
Assignee
|
|
|
SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI |
KYOUNGKI-DO 467-860, KOREA, REPUBLIC OF |
|
Correspondence name and address
|
|
FINNEGAN, HENDERSON, FARABOW ET AL
|
|
ERNEST F. CHAPMAN
|
|
1300 I STREET, N.W.
|
|
WASHINGTON, DC 20005-3315
|
Search Results as of:
09/22/2024 09:05 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|