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Reel/Frame:042390/0126   Pages: 6
Recorded: 05/16/2017
Attorney Dkt #:68293-569001US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/10/2020
Application #:
15596113
Filing Dt:
05/16/2017
Publication #:
Pub Dt:
03/29/2018
Title:
ELECTRONIC PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
Assignors
1
Exec Dt:
03/17/2017
2
Exec Dt:
03/17/2017
3
Exec Dt:
03/17/2017
4
Exec Dt:
03/17/2017
5
Exec Dt:
03/17/2017
6
Exec Dt:
03/17/2017
7
Exec Dt:
03/17/2017
8
Exec Dt:
03/17/2017
9
Exec Dt:
03/17/2017
Assignee
1
NO. 123, SEC. 3, DAFENG RD.
TANZI DIST.
TAICHUNG CITY, TAIWAN 427
Correspondence name and address
MINTZ LEVIN
ONE FINANCIAL CENTER
BOSTON, MA 02111

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