Patent Assignment Details
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| Reel/Frame: | 005316/0130 | |
| Pages: | 3 |
| | Recorded: | 05/07/1990 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/28/1992
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Application #:
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07520011
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Filing Dt:
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05/07/1990
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Title:
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PLUGGABLE ELECTRONIC CIRCUIT PACKAGE ASSEMBLY WITH SNAP TOGETHER HEAT SINK HOUSING
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Correspondence name and address
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L. R. FRALEY
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IBM CORP.,
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DEPT. N50/251-2, IP LAW,
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1701 NORTH ST.,
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ENDICOTT, NY 13760
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